Apparatus and method for molding simultaneously a plurality of semiconductor devices

Abstract

Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.

1 . A method for detecting abnormal operation in simultaneously molding a plurality of semiconductor devices, the method comprising the steps of: 
 sensing pressures that are generated while a plurality of plungers ascend and descend;    limiting movement of the plungers to a predetermined extent that prevents the plungers from deviating from a plunger block;    injecting a molding compound to encapsulate the plurality of the semiconductor devices in a mold using the plurality of plungers;    comparing values of the pressures generated while the plurality of plungers ascend and descend with a value of normal pressure applied when the plungers operate properly; and    determining whether the plungers operate improperly.    
   
   
       2 . A method for detecting abnormal operation in simultaneously molding a plurality of semiconductor devices, the method comprising the steps of: 
 limiting movement of the plungers to a predetermined extent that prevents the plungers from deviating from a plunger block which has a limit bar;    injecting a molding compound to encapsulate the plurality of the semiconductor devices in a mold using the plurality of plungers, each of the plungers having plunger protrusions;    sensing whether the plunger protrusions of the plurality of plungers contact the limit bar during operation of the plungers;    determining whether the plungers operate improperly,    wherein if a plunger protrusion of a corresponding plunger is not in contact with the limit bar when the plungers start descending, the corresponding plunger is determined as operating improperly.