US2006113583A1PendingUtilityA1

Twin EEPROM memory transistors with subsurface stepped floating gates

Assignee: ATMEL CORPPriority: Apr 25, 2003Filed: Jan 17, 2006Published: Jun 1, 2006
Est. expiryApr 25, 2023(expired)· nominal 20-yr term from priority
Inventors:Bohumil Lojek
H10D 64/01326H10D 30/6894H10D 30/6891H10D 30/6728H10D 30/686H10D 30/673H10D 30/0411H10D 30/0323H10D 30/031H10D 30/687G11C 16/0433H10B 43/27H10B 41/23H10B 69/00G11C 2216/10H10B 41/60H10B 41/30
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Claims

Abstract

A memory array with memory cells arranged in rows and columns with each cell having twin EEPROMs featuring subsurface stepped floating gates for electric field concentration. The twin EEPROMs employ only a single layer of poly, one portion being a floating gate of each EEPROM and another portion being word lines. The twin EEPROMs share a common subsurface electrode by having diffused control lines and a diffused bit line. The two EEPROMs are symmetric across the common electrode.

Claims

exact text as granted — not AI-modified
1 . In an EEPROM transistor in a memory array of the EEPROM type fabricated in a silicon wafer with an oxide coating on the wafer surface, with a source, drain and floating gate, the improvement comprising a step in floating gate extending at least partially below the wafer surface and a first capacitor control element with first and second capacitor plates, the first plate connected to the floating gate.  
     
     
         2 . The transistor of  claim 1  having a second capacitor connected to a source or drain electrode.  
     
     
         3 . The transistor of  claim 1  wherein said second capacitor has plates associated with a word line and a bit line of the memory array.  
     
     
         4 . The transistor of  claim 1  wherein said step has top and bottom corners.

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