Thin film forming apparatus and thin film forming method

Abstract

Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

1 - 9 . (canceled)  
   
   
       10 . A thin film forming method in which a substrate and a sheet film are pressed against each other within a thin film forming chamber and a thin film disposed on a substrate-side major surface of said sheet film is transferred to said substrate, 
 characterized in that the pressure inside said thin film forming chamber becomes different between before and during the transfer.    
   
   
       11 . The thin film forming method of  claim 10 , wherein reduction of the pressure inside said thin film forming chamber is started from before the transfer, and in response to the start of the transfer, the pressure inside said thin film forming chamber is decreased smaller than that before the transfer.  
   
   
       12 . The thin film forming method of  claim 11 , wherein the volume of exhaust air from said thin film forming chamber per unit time is adjusted and the pressure inside said thin film forming chamber is accordingly controlled.