Polishing composition

Abstract

The present invention provides a polishing composition containing an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or more amino groups, two or more imino groups, or one or more amino groups and one or more imino groups; a method for manufacturing a substrate with the polishing composition; and a method for reducing surface stains of a substrate with the polishing composition. The polishing composition can be suitably used, for example, in the manufacturing step for a substrate for a hard disk such as a memory hard disk.

1 . A polishing composition comprising an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or more amino groups, two or more imino groups, or one or more amino groups and one or more imino groups.  
   
   
       2 . The polishing composition according to  claim 1 , wherein the abrasive is an alumina.  
   
   
       3 . The polishing composition according to  claim 1 , wherein the organic nitrogen-containing compound has a molecular weight of from 150 to 100000.  
   
   
       4 . The polishing composition according to  claim 1 , wherein the organic nitrogen-containing compound is contained in an amount of from 0.001 to 0.5% by weight of the polishing composition.  
   
   
       5 . The polishing composition according to  claim 1 , wherein the organic nitrogen-containing compound and the organic polybasic acid are contained in a weight ratio of the organic nitrogen-containing compound/the organic polybasic acid of from 1/10000 to 1/1.  
   
   
       6 . The polishing composition according to  claim 1 , further comprising an oxidizing agent.  
   
   
       7 . The polishing composition according to  claim 1 , wherein the polishing composition has a pH of from 1 to 7.  
   
   
       8 . A method for manufacturing a substrate, comprising the steps of feeding the polishing composition as defined in  claim 1  to a substrate to be polished at a flow rate of from 0.01 to 0.5 mL/minute per 1 cm 2  of the substrate, and polishing the substrate with a polishing pad.  
   
   
       9 . The method according to  claim 8 , wherein a polishing pressure is from 2 to 30 kPa.  
   
   
       10 . A method for reducing surface stains on a substrate, comprising the step of feeding the polishing composition as defined in  claim 1  to a substrate to be polished at a flow rate of from 0.01 to 0.5 mL/minute per 1 cm 2  of the substrate, and polishing the substrate with a polishing pad.