Method for patterning carbon nanotube coating and carbon nanotube wiring
Abstract
A method for making a nanocomposite electrode or circuit pattern includes forming a continuous carbon nanotube layer impregnated with a binder and patterning the binder resin using various printing or photo imaging techniques. An alternative method includes patterning the carbon nanotube layer using various printing or imaging techniques and subsequently applying a continuous coating of binder resin to the patterned carbon nanotube layer. Articles made from these patterned nanocomposite coatings include transparent electrodes and circuits for flat panel displays, photovoltaics, touch screens, electroluminescent lamps, and EMI shielding.
Claims
exact text as granted — not AI-modified1 . A carbon nanotube wiring comprising:
a substrate; and a patterned wiring line or electrode disposed on the substrate and comprising carbon nanotubes.
2 . The carbon nanotube wiring of claim 1 , wherein the wiring line or the electrode further comprises a binder or a photoresist.
3 . The carbon nanotube wiring of claim 1 , wherein the carbon nanotubes have an outer diameter of 3.5 nm or smaller.
4 . The carbon nanotube wiring of claim 1 , wherein the wiring line or the electrode further comprises metal fillers.
5 . The carbon nanotube wiring of claim 4 , wherein the metal fillers comprises silver, gold, copper or combinations thereof.
6 . The carbon nanotube wiring of claim 1 , wherein the wiring line or the electrode has a surface resistance in a range between 10 2 and 10 4 ohms/square.
7 . The carbon nanotube wiring of claim 1 , wherein the wiring line or the electrode has a volume resistance in a range between 10 −2 and 10 0 ohms-cm.
8 . The carbon nanotube wiring of claim 1 , wherein the wiring line or the electrode has a light transmittance of 80% or higher.
9 . The carbon nanotube wiring of claim 1 , wherein the wiring line or the electrode has a carbon nanotube concentration between 5% and 50% by volume.
10 . The carbon nanotube wiring of claim 1 , further comprising an insulating layer disposed on the wiring line or the electrode.
11 . The carbon nanotube wiring of claim 1 , wherein the substrate is a glass substrate, a polymer substrate, a silicon wafer, a prepreg or combination thereof.
12 - 41 . (canceled)Join the waitlist — get patent alerts
Track US2006111008A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.