Controlled use of photochemically susceptible chemistries for etching, cleaning and surface conditioning

Abstract

Radiant energy may be applied to a photochemically susceptible etching or conditioning solution to enable precise control of the removal of material or alteration of the top surface of a wafer during the fabrication of semiconductor integrated circuits. A particular condition may be detected during the course of photoactivated generation of free radicals or molecular activation to control the further generation of said species by controlling the radiant energy exposure of a wafer.

1 . an article comprising a medium storing instructions that enable a processor-based system to: 
 detect a condition on a semiconductor wafer; and    in response to the detection of a condition, alter the exposure of the wafer to radiant energy.    
   
   
       2 . The article of  claim 1  further storing instructions that enable the processor-based system to use a detector to detect light reflection from said wafer.  
   
   
       3 . The article of  claim 1  further storing instructions that enable the processor-based system to use a detector to detect chemical species present on said wafer.  
   
   
       4 . The article of  claim 1  further storing instructions that enable the processor-based system to vary the intensity of radiant energy exposure in response to the detection of a condition.  
   
   
       5 . The article of  claim 1  further storing instructions that enable the processor-based system to vary the wavelength of radiant energy exposure in response to the detection of a condition.  
   
   
       6 . A system for etching a semiconductor wafer comprising: 
 a platen to support the wafer;    a radiant energy source to expose said wafer to radiant energy;    a dispersion device to disperse a photochemically susceptible material over said wafer;    a detector to detect a condition on said wafer; and    a controller coupled to said detector and said radiant energy source to control the operation of said radiant energy source in response to the detection of the condition on said wafer.    
   
   
       7 . The system of  claim 6  wherein said controller is coupled to said photochemically susceptible material dispersion device to control the flow of said material to said wafer.  
   
   
       8 . The system of  claim 6  wherein said platen is coupled to a motor to rotate said platen and said controller is coupled to said motor to control the speed of rotation of said platen.  
   
   
       9 . The system of  claim 6  wherein said detector detects reflection from said wafer.  
   
   
       10 . The system of  claim 6  wherein said detector detects chemical species associated with said wafer.  
   
   
       11 . The system of  claim 6  wherein said radiant energy source is an ultraviolet light source.  
   
   
       12 . The system of  claim 6  wherein said controller selectively either turns off the said light source in response to the detection of a condition or varies the intensity of said light source without turning off said light source.