Methods and apparatus for reducing an electronic device manufacturing tool footprint

Abstract

In at least one aspect, a method includes positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and positioning a mainframe power supply in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint. Additionally, or alternatively, a mainframe controller may be placed so that the footprint thereof substantially overlaps the footprint of the load lock. Numerous other aspects are also provided.

1 . A method of reducing an electronic device manufacturing tool footprint, comprising: 
 positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and    positioning a mainframe power supply in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.    
   
   
       2 . The method of  claim 1  wherein positioning the mainframe power supply in the second floor area, wherein a substantial portion of the second floor area is within the first floor area, includes positioning the mainframe power supply in the second floor area, wherein all of the second floor area is within the first floor area.  
   
   
       3 . The method of  claim 1  further comprising reducing wiring required by the electronic device manufacturing tool.  
   
   
       4 . The method of  claim 1  further comprising positioning a mainframe controller in a third floor area, wherein a substantial portion of the third floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.  
   
   
       5 . The method of  claim 4  wherein positioning the mainframe controller in the third floor area, wherein a substantial portion of the third floor area is within the first floor area, includes positioning the mainframe controller in the third floor area, wherein all of the third floor area is within the first floor area.  
   
   
       6 . A method of reducing an electronic device manufacturing tool footprint, comprising: 
 positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and    positioning a mainframe controller in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.    
   
   
       7 . The method of  claim 6  wherein positioning the mainframe controller in the second floor area, wherein a substantial portion of the second floor area is within the first floor area, includes positioning the mainframe controller in the second floor area, wherein all of the second floor area is within the first floor area.  
   
   
       8 . The method of  claim 6  further comprising reducing wiring required by the electronic device manufacturing tool.  
   
   
       9 . The method of  claim 6  further comprising positioning a mainframe power supply in a third floor area, wherein all of the third floor area is within the first floor area.  
   
   
       10 . A method of reducing an electronic device manufacturing tool shipping cost, comprising: 
 placing a load lock and at least one of a mainframe power supply and a mainframe controller of an electronic device manufacturing tool into a container; and    shipping the container.    
   
   
       11 . The method of  claim 10  further comprising placing both the main frame power supply and the mainframe controller of the electronic device manufacturing tool into the container prior to shipping.  
   
   
       12 . An apparatus for reducing an electronic device manufacturing tool footprint, comprising: 
 a load lock frame;    a load lock of an electronic device manufacturing tool coupled to the load lock frame such that the load lock occupies a first floor area; and    a mainframe power supply coupled to the load lock frame, such that the mainframe power supply occupies a second floor area wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.    
   
   
       13 . The apparatus of  claim 12  wherein all of the second floor area is within the first floor area.  
   
   
       14 . The apparatus of  claim 12  further comprising a mainframe controller coupled to the load lock frame such that the mainframe controller occupies a third floor area, wherein a substantial portion of the third floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.  
   
   
       15 . The apparatus of  claim 14  wherein all of the third floor area is within the first floor area.  
   
   
       16 . An apparatus for reducing an electronic device manufacturing tool footprint, comprising: 
 a load lock frame;    a load lock of an electronic device manufacturing tool coupled to the load lock frame such that the load lock occupies a first floor area; and    a mainframe controller coupled to the load lock frame such that the mainframe controller occupies a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.    
   
   
       17 . The apparatus of  claim 16  wherein all of the second floor area is within the first floor area.  
   
   
       18 . The apparatus of  claim 17  further comprising a mainframe power supply coupled to the load lock frame such that the mainframe power supply occupies a third floor area, wherein a substantial portion of the third floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint.  
   
   
       19 . The apparatus of  claim 18  wherein all of the third floor area is within the first floor area.  
   
   
       20 . An apparatus comprising: 
 an electronic device manufacturing tool having a mainframe that occupies a first footprint, and    a mainframe power supply that occupies a second footprint that substantially overlaps the first footprint.    
   
   
       21 . The apparatus of  claim 20  further comprising a mainframe controller that occupies a third footprint that substantially overlaps the first footprint.