US2006103019A1PendingUtilityA1

Socket grid array

39
Individually held — no corporate assignee on recordPriority: Feb 5, 2004Filed: Dec 13, 2005Published: May 18, 2006
Est. expiryFeb 5, 2024(expired)· nominal 20-yr term from priority
Inventors:Kenneth Hodson
H05K 2203/167H05K 2201/0367Y10T29/49126H05K 3/3436E04H 4/1209Y10T29/4913H05K 2201/09745Y10T29/49128H05K 3/4007C02F 1/00C02F 2103/42H05K 2201/10992H10W 90/724H10W 72/07236H10W 72/07227H10W 72/251H10W 72/241H10W 72/072H10W 90/701H10W 72/20Y02P70/50
39
PatentIndex Score
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Cited by
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References
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Claims

Abstract

Assembly methods and semiconductor device assemblies are disclosed in which corresponding IC sockets and PCB projections are used for alignment and bond formation between IC and PCB components of a completed assembly, for example, a BGA. Embodiments of the invention further provide the capability of disassembly and reassembly.

Claims

exact text as granted — not AI-modified
1 . A method of assembling a semiconductor device comprising the steps of: 
 providing a plurality of sockets on the mounting surface of an IC;    providing a plurality of projections on the mounting surface of a PCB;    positioning the IC and the PCB such that a plurality of the sockets and a plurality of the projections are in alignment; and    affixing the IC to the PCB whereby the aligned sockets and projections maintain the proper positioning of the IC and the PCB.    
   
   
       2 . A method according to  claim 1  further comprising the step of subsequently detaching the IC from the PCB.  
   
   
       3 . A method according to  claim 2  further comprising the step of subsequently reaffixing the IC to the PCB.  
   
   
       4 . A method according to  claim 1  wherein the step of affixing the IC to the PCB further comprises the step of reflowing solder there-between.  
   
   
       5 . A method according to  claim 1  wherein the step of providing projections on the mounting surface of the PCB further comprises a step of applying high melting point solder to selected locations on the PCB.  
   
   
       6 . A method according to  claim 1  wherein the step of providing projections on the mounting surface of the PCB further comprises a step of attaching metallic projections to selected locations on the PCB.  
   
   
       7 . A method according to  claim 1  wherein the step of providing projections on the mounting surface of the PCB further comprises a step of attaching metallic projections to selected locations on the PCB using high melting point solder.  
   
   
       8 . A method according to  claim 1  wherein the step of affixing the IC to the PCB further comprises a step of applying low melting point solder to the sockets of the IC.  
   
   
       9 . A method according to  claim 8  further comprising the step of subsequently detaching the IC from the PCB by reflowing the low melting point solder.  
   
   
       10 . A method according to  claim 1  wherein the step of providing a plurality of sockets on the mounting surface of the IC further comprises steps of patterning and etching selected locations on the mounting surface.  
   
   
       11 . A method according to  claim 1  wherein the step of providing a plurality of sockets on the mounting surface of the IC further comprises a step of drilling selected locations on the mounting surface.  
   
   
       12 . A method according to  claim 1  wherein the step of providing a plurality of sockets on the mounting surface of the IC further comprises a step of punching selected locations on the mounting surface.  
   
   
       13 - 24 . (canceled)

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