US2006099759A1PendingUtilityA1
Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate
Est. expiryMay 16, 2023(expired)· nominal 20-yr term from priority
Inventors:Hironori Hasei
B82Y 30/00H05K 3/1241H10K 71/13
50
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Claims
Abstract
A pattern formation method for forming a film pattern upon a substrate, including the steps of: forming banks in a predetermined pattern upon the substrate; disposing liquid drops of a functional liquid at the end portions of groove portions which are defined between the banks; and after having disposed the drops at the end portions of the groove portions, disposing liquid drops in positions of the groove portions other than the end portions thereof.
Claims
exact text as granted — not AI-modified1 . Pattern formation apparatus for forming a film pattern upon a substrate, comprising a liquid drop ejection device for disposing liquid drops of a functional liquid upon said substrate, wherein said liquid drop ejection device is adapted to:
dispose liquid drops at end portions of groove portions which are defined between banks which have been formed in advance upon said substrate according to a predetermined pattern; and dispose liquid drops at positions of said groove portions other than said end portions after disposing said liquid drops at said end portions of groove.
2 . Pattern formation apparatus for forming a film pattern upon a substrate, comprising a liquid drop ejection device for disposing liquid drops of a functional liquid upon said substrate, wherein said liquid drop ejection device is adapted to:
dispose liquid drops at end portions of a pattern formation region upon said substrate in which a predetermined pattern is to be formed and around which a liquid repelling layer has been provided in advance; and dispose liquid drops at positions of said pattern formation region other than said end portions after disposing said liquid drops at said end portions of said pattern formation region.Join the waitlist — get patent alerts
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