Semiconductor device and method for manufacturing same

Abstract

A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

1 . A semiconductor device comprising: 
 a substrate having a component mount face with semiconductor chips mounted thereover, said substrate being provided with a plurality of external terminals; and    a case body made of resin, placed over the component mount face of said substrate so as to cover the same, said case body having a first body part, and a second body part larger in thickness than the first body part,    wherein product information in the form of inscriptions is engraved on the second body part of said case body.    
     
     
         2 . A semiconductor device according to  claim 1 , wherein only common information common to a plurality of customers among the product information is engraved.  
     
     
         3 . A semiconductor device according to  claim 2 , wherein the common information includes a standard specification name and a name of country of manufacture.  
     
     
         4 . A semiconductor device according to  claim 1 , wherein said case body is made of a thermoplastic resin.  
     
     
         5 . A semiconductor device according to  claim 1 , wherein customer information among the product information is displayed with a print on said case body.  
     
     
         6 . A semiconductor device according to  claim 1 , wherein a seal for displaying the customer information among the product information is stuck to said case body.  
     
     
         7 . A semiconductor device according to  claim 6 , wherein the seal is stuck to the first body part of said case body.  
     
     
         8 . A semiconductor device according to  claim 1 , wherein said substrate is disposed in the first body part of said case body.  
     
     
         9 . A semiconductor device according to  claim 8 , wherein said semiconductor chips are resin-encapsulated by a sealing body over said substrate.  
     
     
         10 . A semiconductor device according to  claim 9 , wherein said sealing body is formed of an epoxy-based thermosetting resin.  
     
     
         11 . A semiconductor device according to  claim 1 , wherein said semiconductor chips include a semiconductor chip having a controller circuit, and another semiconductor chip having a memory circuit, operation thereof being controlled by said controller circuit.  
     
     
         12 . A semiconductor device comprising: 
 a substrate having a component mount face with semiconductor chips mounted thereover and a back surface opposite to the component mount face, said substrate being provided with a plurality of external terminals;    a first case body made of resin, placed over said component mount face of said substrate so as to cover the same; and    a second case body made of resin, placed over said back surface so as to cover the same, and bonded to said first case body,    wherein at least one of said first case body and said second case body is provided with a first body part and a second body part larger in thickness than said first body part, and product information is engraved on said second body part.    
     
     
         13 . A semiconductor device according to  claim 12 , wherein only common information common to a plurality of customers among the product information is engraved.  
     
     
         14 . A semiconductor device according to  claim 13 , wherein the common information includes a standard specification name and a name of country of manufacture.  
     
     
         15 . A semiconductor device according to  claim 12 , wherein the first and second case bodies each are made of a thermoplastic resin.  
     
     
         16 . A semiconductor device according to  claim 12 , wherein customer information among the product information is displayed by a print on at least one of the first and second case bodies.  
     
     
         17 . A semiconductor device according to  claim 12 , wherein a seal for displaying the customer information among the product information is stuck to at least one of the first and second case bodies.  
     
     
         18 . (canceled)  
     
     
         19 . (canceled)