Chip part manufacturing method and chip parts

Abstract

The present invention provides a chip part manufacturing method comprising a separating process capable of suppressing deformation of chip parts, and also provides chip parts. It comprises a step of forming a plurality of frame-like void portions ( 32 ) in one main surface of substrate ( 30 ) and insulating resin layer ( 20 ) having a spiral void portion ( 40 ) disposed in the region thereof, a step of forming metal layer ( 36 ) in frame-like void portion ( 32 ) and spiral void portion ( 40 ) and on insulating resin layer ( 20 ), a step of polishing metal layer ( 36 ) at least up to the upper surface of insulating resin layer and forming coil section ( 18 ) in spiral void portion ( 40 ), and a step of forming a metal layer for connecting chip parts to frame-like void portion ( 32 ), wherein the metal layer is melted and removed by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection.

1 . A chip part manufacturing method, comprising a process of separating a plurality of chip parts connected to each other by a connection on one main surface of a substrate, wherein the connection is removed by using an etching agent or release agent to separate the plurality of chip parts connected to each other by the connection.  
     
     
         2 . The chip part manufacturing method of  claim 1 , wherein the connection is formed from metal layer, and the metal layer is melted and removed by using an etching agent to separate the plurality of chip parts into individual pieces.  
     
     
         3 . The chip part manufacturing method of  claim 1 , wherein the connection is formed from resist, and the resist is removed by a release agent to separate the plurality of chip parts into individual pieces.  
     
     
         4 . The chip part manufacturing method of  claim 1 , wherein the connection is formed from insulating resin layer, and the insulating resin layer is removed by using a release agent to separate the plurality of chip parts into individual pieces.  
     
     
         5 . The chip part manufacturing method of  claim 1 , wherein the plurality of chip parts connected by the connection are disposed on a substrate formed with a release layer, and the release layer is removed by using a release agent to separate the plurality of chip parts.  
     
     
         6 . The chip part manufacturing method of  claim 5 , wherein the bonding strength of the connection adhering to the release layer is greater than the connecting strength of the plurality of chip parts connected to each other by the connection.  
     
     
         7 . The chip part manufacturing method of  claim 1 , comprising the steps of: forming an insulating resin layer having a plurality of frame-like void portions adjacent each other and a spiral void portion disposed in a region of the frame-like void portion; forming a metal layer in the frame-like void portion and the spiral void portion and on the insulating resin layer; polishing the metal layer at least up to the upper surface of the insulating resin layer, forming a coil section formed from spiral metal layer in the spiral void portion, and forming the metal layer which connects the chip parts in the frame-like void portions.  
     
     
         8 . The chip part manufacturing method of  claim 7 , wherein the frame-like void portion is generally squared and its inner periphery corner is arcuate.  
     
     
         9 . The chip part manufacturing method of  claim 7 , wherein the insulating resin layer having the frame-like void portion and the spiral void portion is formed by a photolithography process.  
     
     
         10 . The chip part manufacturing method of  claim 9 , wherein the insulating resin layer is formed from a photosensitive resin material obtained by hardening photosensitive resin.  
     
     
         11 . The chip part manufacturing method of  claim 7 , wherein the metal layer is formed by a plating process.  
     
     
         12 . The chip part manufacturing method of  claim 7 , wherein the metal layer has a surface conductor layer formed by a non-electrolytic plating process or a sputtering process or an evaporation process, and is formed on the surface conductor layer by an electrolytic plating process.  
     
     
         13 . The chip part manufacturing method of  claim 1 , comprising the steps of: forming a plurality of frame-like void portions in one main surface of a substrate; forming a first metal layer to form a first metal layer in the frame-like void portion; etching a part of the first metal layer; forming an insulating resin layer having a spiral void portion in a region of the frame-like void portion; forming a second metal layer to form a second metal layer in the frame-like void portion and the spiral void portion and on the insulating resin layer; polishing the second metal layer at least up to the upper surface of the insulating resin layer and forming a coil section formed from spiral metal layer in the spiral void portion; forming a protective layer on the coil section; and removing the first metal layer and the second metal layer formed in the frame-like void portion by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection.  
     
     
         14 . A chip part having a squared element and an electrode disposed at an end of the element, wherein a first corner formed by surfaces vertical to a mounting surface which adjoin each other is generally arcuate, and a second corner formed by surfaces vertical and parallel to a mounting surface which adjoin each other is generally squared.  
     
     
         15 . The chip part of  claim 14 , wherein the electrode is formed with the first corner and the second corner.  
     
     
         16 . The chip part of  claim 14 , wherein the element is formed with the first corner, and the electrode is formed with the second corner.  
     
     
         17 . The chip part of  claim 14 , wherein the element is an insulating resin layer formed from a photosensitive resin material obtained by hardening photosensitive resin, and a coil section formed from spiral metal layer is buried in the insulating resin layer.  
     
     
         18 . The chip part of  claim 14 , wherein the photosensitive resin material is transparent.  
     
     
         19 . The chip part of  claim 14 , which is manufactured by the chip part manufacturing method of  claim 13.