Substrate processing method, system and program

Abstract

A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.

1 . A substrate processing method used for a substrate processing system having a substrate processing device and a substrate transfer device, comprising: 
 a substrate transfer step of transferring a substrate; and    a substrate processing step of performing a predetermined process on the substrate,    wherein the substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously.    
   
   
       2 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 an accommodating chamber;    a mounting table placed in the accommodating chamber to be mounted thereon the substrate; and    a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table, and    wherein a vacuum pumping operation for vacuum pumping the heat transfer gas supply line and a transferring operation for transferring the substrate into the accommodating chamber are performed simultaneously.    
   
   
       3 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 an accommodating chamber;    a mounting table placed in the accommodating chamber to be mounted thereon the substrate; and    elevation pins protruded from the mounting table to move up and down the substrate, and    wherein a pin protruding operation for protruding the elevation pins and a transferring operation for transferring the substrate into the accommodating chamber are performed simultaneously.    
   
   
       4 . The substrate processing method of  claim 3 , wherein a pin moving-down operation for moving down the elevation pins and a taking-out operation for taking the substrate out of the accommodating chamber are performed simultaneously.  
   
   
       5 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 an accommodating chamber; and    a pressure control unit for controlling a pressure in the accommodating chamber, and    wherein a taking-in operation for taking the substrate into the accommodating chamber and a pressure-up operation for increasing the pressure in the accommodating chamber by the pressure control unit are performed simultaneously.    
   
   
       6 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 an accommodating chamber;    a mounting table placed in the accommodating chamber to be mounted thereon the substrate;    a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table;    a high frequency power supply for supplying a high frequency power to the mounting table; and    a gas flow rate control and supply unit for controlling a flow rate of a desired gas to supply the desired gas into the accommodating chamber, and    wherein an application stopping operation for stopping an application of the high frequency power by the high frequency power supply, a gas supply stopping operation for stopping a supply of the gas by the gas flow rate control and supply unit, and a vacuum pumping operation for vacuum pumping the heat transfer gas supply line are performed simultaneously.    
   
   
       7 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 an accommodating chamber;    a mounting table placed in the accommodating chamber to be mounted thereon the substrate;    elevation pins protruded from the mounting table to move up and down the substrate;    a pressure control unit for controlling a pressure in the accommodating chamber; and    a gas flow rate control and supply unit for controlling a flow rate of a desired gas to supply the desired gas into the accommodating chamber, and    wherein a pin protruding operation for protruding the elevation pins, a pressure-down operation for decreasing the pressure in the accommodating chamber by the pressure control unit, and a gas supply stopping operation for stopping a supply of the gas by the gas flow rate control and supply unit are performed simultaneously.    
   
   
       8 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 a substrate counting unit of an arm shape for counting the number of substrates accommodated in a substrate accommodating unit, the substrate transfer device being configured in a manner capable of being moved up and down, flexible and extensible, and    wherein, after counting the number of the substrates accommodated in the substrate accommodating unit, an elevating operation for moving up and down the substrate counting unit and a contracting operation for contracting the substrate counting unit are performed simultaneously.    
   
   
       9 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 an accommodating chamber;    a mounting table placed in the accommodating chamber to be mounted thereon the substrate, capable of moving up and down; and    a pressure control unit for controlling a pressure in the accommodating chamber, and    wherein a pressure-up operation for increasing the pressure in the accommodating chamber by the pressure control unit and a mounting table elevating operation for moving up the mounting table are performed simultaneously.    
   
   
       10 . The substrate processing method of  claim 1 , wherein a pressure-down operation for decreasing the pressure in the accommodating chamber by the pressure control unit and a mounting table moving-down operation for moving down the mounting table are performed simultaneously.  
   
   
       11 . The substrate processing method of  claim 1 , wherein the substrate processing device includes: 
 an accommodating chamber;    a mounting table placed in the accommodating chamber to be mounted thereon the substrate;    elevation pins protruded from the mounting table to move up and down the substrate; and    a door unit capable of being opened and closed for connecting the substrate transfer device and the substrate processing device, and    wherein a pin protruding operation for protruding the elevation pins and a closing operation for closing the door unit are performed simultaneously.    
   
   
       12 . A substrate processing system comprising: 
 a substrate processing device and a substrate transfer device,    wherein the substrate processing device and the substrate transfer device include a plurality of elements, and, at least in case of processing a substrate or transferring the substrate, at least two elements among the plurality of the elements are operated simultaneously.    
   
   
       13 . A substrate processing program for making a computer perform a substrate processing method used for a substrate processing system having a substrate processing device and a substrate transfer device, comprising: 
 a substrate transferring module for transferring a substrate; and    a substrate processing module for processing the substrate,    wherein the substrate transferring module and the substrate processing module include a plurality of operations, and at least two of the plurality of the operations are performed simultaneously.