Solders

Abstract

A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.

1 . A substantially lead-free solder, comprising: 
 from around 96.8% to around 99.3% tin;    from around 0.2% to around 3.0% copper; and    from around 0.02% to around 0.12% silicon.    
   
   
       2 . A solder according to  claim 1 , further comprising from around 0.005% to around 0.01% phosphorous.  
   
   
       3 . A solder according to  claim 2 , comprising around 0.01% phosphorous.  
   
   
       4 . A solder according to  claim 1 , further comprising from around 0.005% to around 0.01% germanium.  
   
   
       5 . A solder according to  claim 4 , comprising around 0.01% germanium.  
   
   
       6 . A solder according  claim 1 , comprising: 
 around 0.7% copper; and    around 0.02% silicon.    
   
   
       7 . A method of preparing a substantially lead-free solder, comprising the step of mixing tin, copper and silicon such that: 
 the proportion of tin in the solder is from around 96.8% to around 99.3%;    the proportion of copper in the solder is from around 0.2% to around 3.0%; and    the proportion of silicon in the solder is from around 0.02% to around 0.12%.    
   
   
       8 . A method according to  claim 7 , further comprising the step of including from around 0.005% to around 0.01% phosphorous in the solder mixture.  
   
   
       9 . A method according to  claim 8 , comprising the step of including around 0.01% phosphorous in the solder mixture.  
   
   
       10 . A method according to  claim 7 , further comprising the step of including from around 0.005% to around 0.01% germanium in the solder mixture  
   
   
       11 . A method according to  claim 10 , comprising the step of including around 0.01% germanium in the solder mixture.  
   
   
       12 . A method according to  claim 7 , comprising the step of including around 0.7% copper and around 0.02% silicon in the solder mixture.  
   
   
       13 . A method of soldering, comprising the step of using a substantially lead-free solder comprising: 
 from around 96.8% to around 99.3% tin;    from around 0.2% to around 3.0% copper; and    from around 0.02% to around 0.12% silicon.    
   
   
       14 . A method according to  claim 13 , which comprises using a solder having from around 0.005% to around 0.01% phosphorous.  
   
   
       15 . A method according to  claim 14 , which comprises using a solder having around 0.01% phosphorous.  
   
   
       16 . A method according to  claim 13 , which comprises using a solder having from around 0.005% to around 0.01% germanium.  
   
   
       17 . A method according to  claim 16 , which comprises using a solder having around 0.01% germanium.  
   
   
       18 . A method according to  claim 13 , which comprises using a solder having around 0.7% copper and around 0.02% silicon.