US2006086954A1PendingUtilityA1
Multi-layer film stack for extinction of substrate reflections during patterning
Individually held — no corporate assignee on recordPriority: Dec 27, 2000Filed: Dec 7, 2005Published: Apr 27, 2006
Est. expiryDec 27, 2020(expired)· nominal 20-yr term from priority
H10P 76/2043H10W 20/081H10W 20/075H10W 20/47H10P 50/73Y10S438/958Y10S438/945Y10S438/902Y10S438/952Y10S438/95
46
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Claims
Abstract
A method including introducing a dielectric layer over a substrate between an interconnection line and the substrate, the dielectric layer comprising a plurality of alternating material layers; and patterning an interconnection to the substrate. An apparatus comprising a substrate comprising a plurality of devices formed thereon; and an interlayer dielectric layer comprising a base layer and a cap layer, the cap layer comprising a plurality of alternating material layers overlying the substrate.
Claims
exact text as granted — not AI-modified1 . An apparatus comprising:
a substrate comprising a plurality of devices formed thereon; and an interlayer dielectric layer comprising a base layer and a cap layer, the cap layer comprising a plurality of alternating material layers overlying the substrate.
2 . The apparatus of claim 1 , wherein the cap layer comprises silicon dioxide as the ultimate material layer.
3 . The apparatus of claim 1 , wherein the cap layer comprises a plurality of silicon dioxide layers alternated with at least one other material layers.
4 . The apparatus of claim 3 , wherein the number of alternating silicon dioxide layers comprises at least six.Join the waitlist — get patent alerts
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