Low-k dielectric functional imprinting materials

Abstract

In a substantially planar circuit, the conductors are separated by an inorganic material with a dielectric constant of less than about 3.0. The dielectric layers are formed in a process that includes defining trenches and/or vias for the conductors by imprinting an initially planar layer of a radiation curable composition. The imprinting die is preferably UV transparent such that the composition is UV cured while the imprint die is in place. The curable composition includes an organic modified silicate compound and a second decomposable organic component, the latter forming nanometer scale pores as the organic compounds are subsequently decomposed to provide a polysilicate matrix. The pores reduce the effective dielectric constant from that of otherwise dense silicon dioxide.

1 - 7 . (canceled)  
     
     
         8 . A composition of matter that comprises: 
 a) a UV curable organic modified silicate, and    b) a decomposable organic compound,    c) wherein a viscosity of said compound is less than about 200,000 cps.    
     
     
         9 . A composition of matter according to  claim 8  that further comprises a fluorosurfactant.  
     
     
         10 . A composition of matter according to  claim 9  wherein said decomposable organic compound is a polycaprolactone.  
     
     
         11 . A composition of matter according to  claim 9  wherein said decomposable organic compound is chemically bounded to said UV curable organic modified silicate.  
     
     
         12 . A composition of matter that comprises: 
 a) a UV curable organic modified silicate,    b) a decomposable organic compound,    c) a fluorosurfactant, and    d) a solvent for said UV curable organic silicate compound, said decomposable organic compound and said fluorosurfactant.    
     
     
         13 . A composition of matter according to  claim 12  wherein said decomposable organic compound is a polycaprolactone.  
     
     
         14 . A composition of matter according to  claim 12  wherein said decomposable organic compound is chemically bounded to said UV curable organic modified silicate  
     
     
         15 . A composition of matter according to  claim 12  wherein said decomposable organic compound comprises from about 10 to 50 weight percent of said composition.  
     
     
         16 . A composition of matter according to  claim 12  wherein said organic modified silicate has a molecular weight of less than about 50,000 Dalton.  
     
     
         17 . A composition of matter according to  claim 12  having a viscosity of less than about 200,000 cPs.  
     
     
         18 . A composition of matter according to  claim 12  wherein said organic modified silicate comprises at least about 10 weight percent silicon.  
     
     
         19 - 20 . (canceled)