Heat dissipation apparatus and manufacturing method thereof

Abstract

A heat dissipation apparatus. The heat-dissipation apparatus comprises a chamber, a working fluid, an evaporation section and a condensing section. The chamber has an inner wall, and the working fluid is sealed in the chamber. The evaporation section and the condensing section are located at the inner wall. The first grooves are disposed on the inner wall and connected to the evaporation section and the condensing section. The working fluid is vaporized at the evaporation section when absorbing heat from the heat source and condenses to a liquid phase and releases the heat at the condensing section, and the first groove provides a capillary force to drive the working fluid from the condensing section back to the evaporation section.

1 . A heat-dissipation apparatus for a heat source, comprising: 
 a chamber comprising an inner wall;    a working fluid sealed in the chamber;    an evaporation section and a condensing section located at the inner wall; and    at least one first groove disposed on the inner wall and connected to the evaporation section and the condensing section, wherein the working fluid is vaporized at the evaporation section when absorbing heat from the heat source and condenses to a liquid phase and releases the heat at the condensing section, and the first groove provides a capillary force to drive the working fluid from the condensing section back to the evaporation section.    
   
   
       2 . The heat-dissipation apparatus as claimed in  claim 1  further comprising at least one second groove disposed on the inner wall and connected to the first groove.  
   
   
       3 . The heat-dissipation apparatus as claimed in  claim 2 , wherein the chamber is formed by folding a base plate, and each of the second grooves is located at a folded region of the base plate and is relatively wider than the first groove.  
   
   
       4 . The heat-dissipation apparatus as claimed in  claim 2 , wherein the first grooves are either radially extended out from the evaporation section or concentrically disposed and focusing on the evaporation section, or the first grooves and the second grooves form a grid pattern.  
   
   
       5 . The heat-dissipation apparatus as claimed in  claim 2 , wherein the evaporation section, the condensing section, the first grooves and the second grooves are formed on the inner wall of the chamber by a miniature molding process and the miniature molding process includes steps of: 
 providing a substrate;    applying a pre-patterned layer on the substrate and forming the pre-patterned layer into a pre-patterned mold by a Micro Electro-Mechanical System (MEMS) process;    providing a pattern material to the pre-patterned mold to form a patterned mold; and    molding the base plate by the patterned mold, such that the evaporation section, the condensing section, the first grooves, and the second grooves are formed on the base plate.    
   
   
       6 . The heat-dissipation apparatus as claimed in  claim 2 , wherein the evaporation section, the condensing section, the first grooves and the second grooves are formed on the inner wall of the chamber through a mold formed by a laser or a precision manufacturing technique.  
   
   
       7 . The heat-dissipation apparatus as claimed in  claim 1 , wherein the first grooves are either radially extended out from the evaporation section or concentrically disposed and focusing on the evaporation section, or the first grooves and the second grooves form a grid pattern.  
   
   
       8 . The heat-dissipation apparatus as claimed in  claim 1 , wherein the chamber is formed by folding a base plate, and the evaporation section, the condensing section and the first grooves are formed on the base plate by a miniature molding process.  
   
   
       9 . The heat-dissipation apparatus as claimed in  claim 8 , wherein the miniature molding process comprises steps of: 
 providing a substrate;    applying a pre-patterned layer on the substrate and forming the pre-patterned layer into a pre-patterned mold by a Micro Electro-Mechanical System (MEMS) process;    providing a pattern material to the pre-patterned mold to form a patterned mold; and    molding the base plate by the patterned mold, such that the evaporation section, the condensing section and the first grooves are formed on the base plate.    
   
   
       10 . The heat-dissipation apparatus as claimed in  claim 1 , wherein the evaporation section, the condensing section and the first grooves are formed on the inner wall of the chamber through a mold formed by a laser or a precision manufacturing technique.  
   
   
       11 . A method for forming the heat-dissipation apparatus, comprising steps of: 
 providing a base plate;    forming an evaporation section, a condensing section and at least one first groove on the base plate; and    folding the base plate into a chamber so that the evaporation section, the condensing section and the first groove are disposed on an inner wall of the chamber.    
   
   
       12 . The method for forming the heat-dissipation apparatus as claimed in  claim 11  further comprising a step of forming at least one second groove disposed on the inner wall and connected to the first groove.  
   
   
       13 . The method for forming the heat-dissipation apparatus as claimed in  claim 12 , wherein the chamber is formed by folding the base plate, and each of the second grooves is located at a folded region of the base plate and is relatively wider than the first groove.  
   
   
       14 . The method for forming the heat-dissipation apparatus as claimed in  claim 12 , wherein the first grooves are either radially extended out from the evaporation section or concentrically disposed and focusing on the evaporation section, or the first grooves and the second grooves form a grid pattern.  
   
   
       15 . The method for forming the heat-dissipation apparatus as claimed in  claim 12 , wherein the evaporation section, the condensing section, the first grooves and the second grooves are formed on the base plate by a miniature molding process, and the miniature molding process includes steps of: 
 providing a substrate;    applying a pre-patterned layer on the substrate and forming the pre-patterned layer into a pre-patterned mold by a Micro Electro-Mechanical System (MEMS) process;    providing a pattern material to the pre-patterned mold to form a patterned mold; and    molding the base plate by the patterned mold, such that the evaporation section, the condensing section, the first grooves and the second grooves are formed on the base plate.    
   
   
       16 . The method for forming the heat-dissipation apparatus as claimed in  claim 12 , wherein the evaporation section, the condensing section, the first grooves and the second grooves are formed on the base plate through a mold formed by a laser or a precision manufacturing technique.  
   
   
       17 . The method for forming the heat-dissipation apparatus as claimed in  claim 11 , wherein the first grooves are either radially extended out from the evaporation section or concentrically disposed and focusing on the evaporation section, or the first grooves and the second grooves form a grid pattern.  
   
   
       18 . The method for forming the heat-dissipation apparatus as claimed in  claim 11 , wherein the evaporation section, the condensing section and the first grooves are formed on the base plate by a miniature molding process, and the miniature molding process includes steps of: 
 providing a substrate;    applying a pre-patterned layer on the substrate and forming the pre-patterned layer into a pre-patterned mold by a Micro Electro-Mechanical System (MEMS) process;    providing a pattern material to the pre-patterned mold to form a patterned mold; and    molding the base plate by the patterned mold, such that the evaporation section, the condensing section and the first grooves are formed on the base plate.    
   
   
       19 . The method for forming the heat-dissipation apparatus as claimed in  claim 11 , wherein the evaporation section, the condensing section, the first grooves and the second grooves are formed on the base plate through a mold formed by a laser or a precision manufacturing technique.  
   
   
       20 . The method for forming the heat-dissipation apparatus as claimed in  claim 11 , wherein the step of folding the base plate into a chamber further comprises steps of: 
 folding the base plate to form a pipe;    sealing one end of the pipe;    filling a working fluid into the pipe and vacuuming; and    sealing the other end of the pipe.