Method for processing a substrate using multiple fluid distributions on a polishing surface

Abstract

A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled thereto. The restricting device interfaces with the delivery tube and is adapted to provide a variable restriction to flow passing through the delivery tube. In another embodiment, the restricting device is a pinch valve and the tube in continuous from the outlet to beyond a portion that interfaces with the pinch valve. In yet another embodiment, the position of the dispense arm is controllable.

1 . A method for polishing substrate, comprising: 
 creating a first distribution of polishing fluid on a polishing surface;    polishing a substrate on the polishing surface in the presence of the first fluid distribution;    repositioning a polishing fluid dispense arm to create a second distribution of polishing fluid on the polishing surface; and    polishing the substrate on the polishing surface in the presence of the second fluid distribution.    
   
   
       2 . The method of  claim 1 , wherein the step of repositioning the polishing fluid dispense arm further comprises: 
 radially moving a fluid outlet disposed on the arm relative to the polishing surface.    
   
   
       3 . The method of  claim 1 , wherein the step of repositioning the polishing fluid dispense arm further comprises: 
 moving a fluid outlet disposed on the arm parallel to the polishing surface.    
   
   
       4 . The method of  claim 1 , wherein the step of repositioning the polishing fluid dispense arm further comprises: 
 rotating the arm.    
   
   
       5 . The method of  claim 1 , wherein the step of moving the polishing fluid dispense arm further comprises: 
 changing a volumetric distribution of fluid on the polishing surface.    
   
   
       6 . The method of  claim 1  further comprising: 
 moving the polishing fluid dispense arm clear of the polishing surface; and    flowing a fluid through the polishing fluid dispense arm at an increased flow rate relative to a flow rate utilized to create at least one of the first or second fluid distribution.    
   
   
       7 . The method of  claim 6 , wherein the flow rate in the position clear of the polishing surface is greater than flow rates utilized to create the first and second polishing fluid distributions.  
   
   
       8 . The method of  claim 1  further comprising: 
 detecting a metric indicative of material removed while polishing the substrate in the presence of the first fluid distribution; and    moving the dispense arm in response to the detected metric.    
   
   
       10 . A method for processing a substrate, comprising: 
 moving a dispense arm into a first dispense position;    flowing polishing fluid from the dispense arm in the first dispense position to a polishing surface to create a first fluid distribution;    polishing a substrate on the polishing surface having the first fluid distribution;    moving the dispense arm to a second dispense position;    flowing polishing fluid from the dispense arm in the second dispense position to the polishing surface to create a second fluid distribution; and    polishing the substrate on the polishing surface having the second fluid distribution.    
   
   
       11 . The method of  claim 10  further comprising: 
 rotating the dispense arm to a position clear of the polishing surface; and    increasing a flow of fluid from the dispense arm relative to the flows utilized to create the first and second fluid distributions.    
   
   
       12 . The method of  claim 10 , wherein the step of moving further comprises: 
 changing an angular orientation of the dispense arm.    
   
   
       13 . A method for processing a substrate, comprising: 
 flowing processing fluid to a surface through a fluid dispense arm;    processing a substrate on the surface in the presence of a first fluid distribution; and    moving the fluid dispense arm in-situ processing.    
   
   
       14 . The method of  claim 13 , wherein the step of moving further comprises: 
 providing a second distribution of fluid on the surface; and    processing the substrate in the presence of the second distribution of fluid.    
   
   
       15 . The method of  claim 13  further comprising: 
 detecting a metric indicative of material removed while polishing the substrate in the presence of the first fluid distribution; and    moving the dispense arm in response to the detected metric.    
   
   
       16 . The method of  claim 13 , wherein the step of moving the fluid dispense arm further comprises: 
 moving a fluid outlet disposed on the arm parallel to the polishing surface.    
   
   
       17 . The method of  claim 13 , wherein the step of moving the fluid dispense arm further comprises: 
 rotating the arm.    
   
   
       18 . The method of  claim 13  further comprising: 
 moving the fluid dispense arm clear of the surface; and    flowing a fluid through the fluid dispense arm at an increased flow rate relative to a flow rate utilized to create the first fluid distribution.    
   
   
       19 . The method of  claim 18 , wherein the flow rate in the position clear of the surface is greater than flow rates utilized to create the first polishing fluid distribution.