US2006076040A1PendingUtilityA1

Semiconductive substrate cleaning systems

52
Individually held — no corporate assignee on recordPriority: Sep 2, 1999Filed: Nov 30, 2005Published: Apr 13, 2006
Est. expirySep 2, 2019(expired)· nominal 20-yr term from priority
Inventors:Scott E. MooreTrung T. Doan
H10P 72/0412H10P 72/0411B08B 1/14B08B 1/12Y10S134/902Y10S438/974B24B 37/042Y10S438/906B08B 7/0092Y10S438/959Y10S438/963
52
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

In one aspect, the invention includes a method of treating a surface of a substrate. A mixture which comprises at least a frozen first material and liquid second material is provided on the surface and moved relative to the substrate. In another aspect, the invention encompasses a method of treating a plurality of substrates. A treating member is provided proximate a first substrate, and an initial layer of frozen material is formed over a surface of the treating member. A surface of the first substrate is treated by moving at least one of the treating member and the first substrate relative to the other of the treating member and the first substrate. After the surface of the first substrate is treated, the initial layer of frozen material is removed from over the surface of the treating member. The treating member is then provided proximate another substrate, and the surface of the other substrate is treated by moving at least one of the treating member and the second substrate relative to the other of the treating member and the second substrate.

Claims

exact text as granted — not AI-modified
1 - 82 . (canceled)  
   
   
       83 . A semiconductive conductive substrate cleaning system comprising a cleaning member operatively proximate an apparatus configured to couple to a semiconductive substrate, wherein the cleaning member is configured to be at least partially coated with a frozen material.  
   
   
       84 . The system of  claim 83  wherein the frozen material comprises CO 2 .  
   
   
       85 . The system of  claim 83  wherein the cleaning member comprises a brush.  
   
   
       86 . The system of  claim 85  wherein the brush comprises a plurality of bristles configured to be at least partially coated with the frozen material.  
   
   
       87 . The system of  claim 83  wherein the frozen material comprises both a first composition and a second composition different from the first composition.  
   
   
       88 . The system of  claim 87  wherein the first composition comprises CO 2  and the second composition comprises H 2 O.  
   
   
       89 . The system of  claim 87  wherein the cleaning member comprises a brush, the brush comprising a plurality of bristles configured to be at least partially coated with the first composition.  
   
   
       90 . The system of  claim 89  wherein the at least one of the plurality of bristles of the brush is at least partially coated with the second composition.  
   
   
       91 . The system of  claim 83  wherein the semiconductive substrate comprises a monocrystalline silicon wafer.  
   
   
       92 . The system of  claim 83  wherein the cleaning member is elevationally below the semiconductive substrate when coupled to the apparatus.  
   
   
       93 . The system of  claim 92  wherein: 
 the cleaning member comprises a first surface extending horizontally to a first periphery;    the semiconductive substrate comprises a second surface extending horizontally to a second periphery; and    the first surface of the cleaning member extends horizontally beyond the second periphery of the substrate.    
   
   
       94 . The system of  claim 93  wherein one or both of the first and second surfaces are substantially planar.  
   
   
       95 . The system of  claim 83  wherein the cleaning member comprises both a first and a second cleaning member, the first cleaning member being elevationally above the substrate when coupled to the apparatus, and the second cleaning member being elevationally below the substrate when couple to the apparatus.  
   
   
       96 . The system of  claim 95  wherein the frozen material comprises a first composition, the first cleaning member being at least partially coated with the first composition, and wherein the second cleaning member is at least partially coated with a second composition.  
   
   
       97 . The system of  claim 96  wherein the first composition is different from the second composition.  
   
   
       98 . The system of  claim 96  wherein the second composition is a solid composition.  
   
   
       99 . The system of  claim 83  further comprising a liquid material above the frozen material.  
   
   
       100 . The system of  claim 99  wherein the liquid material and the frozen material comprise H 2 O.

Join the waitlist — get patent alerts

Track US2006076040A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.