High pressure pad conditioning

Abstract

An apparatus for conditioning a polishing pad. A turntable is mounted to a frame, where the turntable is adapted to receive and rotate the polishing pad. A conditioning head is also mounted to the frame, where the conditioning head is adapted to spray a liquid from the conditioning head against the polishing pad at a pressure that is sufficient to dislodge eroded material from the polishing pad. In this manner, a sufficiently abrasive spray can be generated, which can release the loaded material from the polishing pad, and otherwise condition the polishing pad. The spray also enables the released material to be washed away from the pad. In addition, because the abrasive action is provided by the force of the spray, there are no abrasive particles that can break free from the conditioning head and disrupt the desired operation of the pad.

1 . An apparatus for conditioning a polishing pad, the apparatus comprising: 
 a frame,    a turntable mounted to the frame, the turntable adapted to receive and rotate the polishing pad,    a conditioning head mounted to the frame, the conditioning head adapted to spray a liquid from the conditioning head against the polishing pad at a pressure that is sufficient to dislodge eroded material from the polishing pad.    
   
   
       2 . The apparatus of  claim 1 , wherein the rotation of the polishing pad enables all desired portions of the polishing pad to be conditioned by the liquid spray.  
   
   
       3 . The apparatus of  claim 1 , further comprising a plurality of nozzles disposed on the conditioning head and from which the liquid is sprayed.  
   
   
       4 . The apparatus of  claim 1 , further comprising a plurality of selectively replaceable nozzles disposed on the conditioning head and from which the liquid is sprayed, where the selectively replaceable nozzles have different spray pattern and flow volume characteristics.  
   
   
       5 . The apparatus of  claim 1 , further comprising a plurality of adjustable nozzles disposed on the conditioning head and from which the liquid is sprayed, where the nozzles can be adjusted in regard to at least one of flow volume and spray pattern.  
   
   
       6 . The apparatus of  claim 1 , further comprising a pressure adjustment means for adjusting the pressure of the liquid spray.  
   
   
       7 . The apparatus of  claim 1 , further comprising height adjustment means for adjusting a distance of the conditioning head from the polishing pad.  
   
   
       8 . The apparatus of  claim 1 , further comprising angle adjustment means for adjusting an angle of the conditioning head relative to an upper surface of the polishing pad.  
   
   
       9 . The apparatus of  claim 1 , further comprising flow adjustment means for adjusting a volume of flow of the liquid sprayed from the conditioning head to the polishing pad.  
   
   
       10 . The apparatus of  claim 1 , further comprising an oscillator for moving the conditioning head relative to the rotating conditioning pad.  
   
   
       11 . The apparatus of  claim 1 , wherein the apparatus is part of a chemical mechanical polisher.  
   
   
       12 . A method of conditioning a polishing pad, the method comprising the steps of: 
 producing relative movement between the polishing pad and a conditioning head,    spraying a liquid from the conditioning head against the polishing pad at a pressure that is sufficient to dislodge eroded material from the polishing pad,    where the relative movement enables all desired portions of the polishing pad to be conditioned by the liquid spray.    
   
   
       13 . The method of  claim 12 , wherein the liquid is sprayed from a plurality of nozzles disposed on the conditioning head.  
   
   
       14 . The method of  claim 12 , wherein the liquid is sprayed from a plurality of selectively replaceable nozzles disposed on the conditioning head, where the selectively replaceable nozzles have different spray pattern and flow volume characteristics.  
   
   
       15 . The method of  claim 12 , wherein the liquid is sprayed from a plurality of adjustable nozzles disposed on the conditioning head, where the nozzles can be adjusted in regard to at least one of flow volume and spray pattern.  
   
   
       16 . The method of  claim 12 , further comprising adjusting the pressure of the liquid spray to a desired pressure.  
   
   
       17 . The method of  claim 12 , further comprising adjusting a distance of the conditioning head from the polishing pad to a desired height.  
   
   
       18 . The method of  claim 12 , further comprising adjusting an angle of the conditioning head relative to an upper surface of the polishing pad to a desired angle.  
   
   
       19 . The method of  claim 12 , further comprising adjusting a volume of flow of the liquid sprayed from the conditioning head to the polishing pad to a desired volume.  
   
   
       20 . A method of conditioning a polishing pad, the method comprising the steps of: 
 rotating the polishing pad,    spraying a liquid from a plurality of nozzles disposed in a conditioning head against the polishing pad at a pressure that is sufficient to dislodge eroded material from the polishing pad, where the rotation of the polishing pad enables all desired portions of the polishing pad to be conditioned by the liquid spray,    adjusting the pressure of the liquid spray to a desired pressure,    adjusting a distance of the conditioning head from the polishing pad to a desired height,    adjusting an angle of the conditioning head relative to an upper surface of the polishing pad to a desired angle, and    adjusting a volume of flow of the liquid sprayed from the conditioning head to the polishing pad to a desired volume.