Hardwood flooring board
Abstract
The present invention is a hardwood flooring board including a middle layer formed from a non-hardwood flooring material and a hardwood material upper layer which is secured to an upper surface of the middle layer that is thick enough to include decorative designs. The middle layer forms between 45% and 75% of the overall material of the board and enables the board to be manufactured to be more dimensionally stable, i.e., wider and longer, than conventional hardwood flooring boards such that the boards can be more uniformly constructed. Also the use of the non-hardwood material in the middle layer greatly increases the dimensional stability and long term performance of the flooring boards, while providing a genuine hardwood appearance to the floor. The board also includes a lower layer that can be formed from either a hardwood material or a non-hardwood material to function as a base for the board. The upper layer is secured to the middle layer by an adhesive that is urged into the openings or cracks in the upper layer during the assembly of the board to prevent the cracks from spreading through the upper layer when the boards are in use.
Claims
exact text as granted — not AI-modified1 - 21 . (canceled)
21 . A flooring board comprising:
a) a first layer formed of a first material having an upper surface and a lower surface, the lower surface including a number of openings extending into the upper layer generally perpendicular to the lower surface; b) a second layer formed of a non-hardwood material; and c) an adhesive joining the lower surface of the first layer to the second layer, the adhesive extending from the lower surface into the openings in the upper surface.
22 . The board of claim 21 wherein the openings in the lower surface of the first layer are cracks created during the formation of the first layer.
23 . The board of claim 21 wherein the first material is a hardwood material.
24 . The board of claim 21 wherein the non-hardwood material is a non-oriented fiberboard.
25 . The board of claim 24 wherein the second layer has a density of at least 790 kg/m 3 .
26 . The board of claim 21 wherein the adhesive has a viscosity of between about 25 poise and about 40 poise.
27 . The board of claim 21 wherein the adhesive is an urea formaldehyde adhesive.
28 . A method of forming a hardwood flooring board, the method comprising the steps of:
a) providing a first layer formed of a hardwood material and having a number of openings on one surface of the first layer, and a second layer formed of a non-hardwood material; b) applying an adhesive to one of the first layer or the second layer; and c) pressing the first layer and the second layer against one another to urge the adhesive into the openings in the first layer.
29 . The method of claim 28 wherein the step of pressing the first layer and the second layer against one another compression pressing the first layer against the second layer of a pressure of at least 200 psi.
30 . A flooring board comprising:
a) an upper layer formed of a hardwood material and having a thickness greater than 2 mm; and b) a middle layer formed of a non-hardwood material and secured to the upper layer, wherein the upper layer includes at least one decorative design opposite the middle layer.
31 . The board of claim 30 wherein the at least one decorative design is a bevel disposed in at least one side of the upper layer.
32 . The board of claim 30 further comprising a lower layer secured to the middle layer opposite the upper layer.
33 . The board of claim 32 wherein the lower layer includes at least one channel adapted to receive a fastener that secures the board directed to a support surface.
34 . The board of claim 30 wherein the upper layer includes a number of openings extending into the upper layer from a lower surface, and further comprising an adhesive extending from the middle layer into the openings in the upper layer.
35 . The board of claim 34 wherein the middle layer has a density of at least 790 kg/m 3 .
36 . The board of claim 30 wherein the upper layer has a thickness of between about 2 mm and about 5 mm.Join the waitlist — get patent alerts
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