Pseudo low volume reticle (PLVR) design for asic manufacturing

Abstract

A Pseudo Low Volume Reticle (PLVR) which consists of multiple design layers on a single reticle. Specifically, the reticle can include two instances of each layer in order to facilitate die-to-die inspection techniques. A scribe is wrapped around each instance of the layer, such that both the frame and active area of the chip can be inspected with the die-to-die method. The chip consists of design data for a given part. The scribe, or frame, is preferably standard data across products which is used for yield and in line testing during the chip manufacturing process. Since only one chip and scribe unit is necessary to manufacture a device at each layer, it is only necessary that one chip and scribe instance yield during the reticle manufacturing process.

1 . A reticle comprising: a plurality of layers, wherein there are a plurality of instances of at least one of the layers.  
     
     
         2 . A reticle as recited in  claim 1 , wherein the reticle includes two instances of each of the layers.  
     
     
         3 . A reticle as recited in  claim 1 , further comprising a scribe proximate at least one of the layers.  
     
     
         4 . A reticle as recited in  claim 1 , further comprising a scribe proximate each of the layers.  
     
     
         5 . A reticle as recited in  claim 1 , further comprising a vertical scribe and a horizontal scribe proximate at least one of the layers.  
     
     
         6 . A reticle as recited in  claim 1 , further comprising a vertical scribe and a horizontal scribe proximate each of the layers.  
     
     
         7 . A reticle as recited in  claim 1 , wherein the reticle is configured such that said layers are inspectible using a die-to-die inspection method.  
     
     
         8 . A reticle as recited in  claim 1 , wherein the reticle is configured such that one of the instances of one the layers is useable for production while avoiding using another instance of the layer, wherein yield is not impacted despite one of the instances containing a defect.  
     
     
         9 . A reticle comprising: a plurality of instances of a first layer, and a plurality of instances of a second layer.  
     
     
         10 . A reticle as recited in  claim 9 , wherein the reticle includes two instances of each of the layers.  
     
     
         11 . A reticle as recited in  claim 9 , further comprising a scribe proximate at least one of the layers.  
     
     
         12 . A reticle as recited in  claim 9 , further comprising a scribe proximate each of the layers.  
     
     
         13 . A reticle as recited in  claim 9 , further comprising a vertical scribe and a horizontal scribe proximate at least one of the layers.  
     
     
         14 . A reticle as recited in  claim 9 , further comprising a vertical scribe and a horizontal scribe proximate each of the layers.  
     
     
         15 . A reticle as recited in  claim 9 , wherein the reticle is configured such that said layers are inspectible using a die-to-die inspection method.  
     
     
         16 . A reticle as recited in  claim 9 , wherein the reticle is configured such that one of the instances of one the layers is useable for production while avoiding using another instance of the layer, wherein yield is not impacted despite one of the instances containing a defect.