Semiconductor laser module, spatial optical transmission system and electronic appliance

Abstract

A highly sensitive and inexpensive spatial optical transmission system using an LD (Laser Diode) as a light source and making use of the characteristics of a light receiving element is provided. The system includes a laser chip oscillating a laser beam, and a light receiving element receiving and converting to an electric signal the laser beam emitted from the laser chip and propagated through a space. The laser chip oscillates a laser beam having a wavelength of which absorption coefficient at the light receiving element is in a range of 0.001 to 0.3 μm −1 .

1 - 9 . (canceled)  
   
   
       10 . A semiconductor laser module, comprising: 
 a circuit board;    a semiconductor laser device mounted on said circuit board;    a silicon based resin, which is a jellied resin having JIS-A hardness of approximately zero after curing, covering at least a light emitting end surface of said semiconductor laser device; and    another sealing resin sealing the semiconductor laser device covered by said silicon based resin on said circuit board.    
   
   
       11 . A spatial optical transmission system including the semiconductor laser module according to  claim 10 , emitting a laser beam to a counterpart light emitting element.  
   
   
       12 . An electronic appliance including the semiconductor laser module according to  claim 10 , responding to data optically transmitted through a space.  
   
   
       13 . The semiconductor laser module according to  claim 10 , wherein 
 said semiconductor device is fixed on a mounting member fixed on said circuit board, and has said light emitting surface made approximately parallel to a surface of said circuit board.    
   
   
       14 . The semiconductor laser module according to  claim 13 , wherein 
 said mounting member includes a heat sink.    
   
   
       15 . A semiconductor laser module, comprising: 
 a circuit board;    a semiconductor laser device mounted on said circuit board and having a light emitting surface arranged approximately parallel to a surface of said circuit board; and    a sealing resin sealing said semiconductor laser device on said circuit board.    
   
   
       16 . An electronic appliance including the semiconductor laser module according to  claim 15 , responding to data optically transmitted through a space.  
   
   
       17 . The semiconductor laser module according to  claim 15 , wherein 
 said semiconductor device is fixed on a mounting member fixed on said circuit board, and has said light emitting surface made approximately parallel to a surface of said circuit board.    
   
   
       18 . The semiconductor laser module according to  claim 17 , wherein 
 said mounting member includes a heat sink.