US2006060834A1PendingUtilityA1
Organic thin-film transistor and method for manufacturing organic thin-film transistor
Assignee: KONICA MINOLTA HOLDINGS INCPriority: Sep 5, 2002Filed: Aug 28, 2003Published: Mar 23, 2006
Est. expirySep 5, 2022(expired)· nominal 20-yr term from priority
Inventors:Katsura Hirai
H10K 85/113H10K 71/10H10K 10/464H10K 10/466H10K 85/151H10K 85/115H10K 99/00
44
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Claims
Abstract
Disclosed are an organic thin-film transistor and a manufacturing comprising thereof, the organic thin-film transistor comprising a support and provided thereon, a gate electrode, an insulation layer, a source electrode, a drain electrode, and an organic semiconductor layer, the support comprising at least one of resins, and the organic semiconductor layer containing at least one of organic semiconductor materials, wherein a phase transition temperature of one of the organic semiconducting materials is not more than a glass transition point of one of the resins.
Claims
exact text as granted — not AI-modified1 . An organic thin-film transistor comprising a support and provided thereon, a gate electrode, an insulation layer, a source electrode, a drain electrode, and an organic semiconductor layer, the support comprising at least one of resins, and the organic semiconductor layer containing at least one of organic semiconducting materials, wherein a phase transition temperature of one of the organic semiconducting materials is not more than a glass transition point of one of the resins.
2 . The organic thin-film transistor of claim 1 , wherein the organic thin-film transistor is manufactured by a process comprising the step in which heat treating is carried out at a heating temperature between the phase transition temperature and the glass transition point.
3 . The organic thin-film transistor of claim 2 , wherein the heating temperature is in the range of from 100 to 250° C.
4 . The organic thin-film transistor of claim 1 , further comprising an orientation layer provided in contact with the organic semiconductor layer.
5 . The organic thin-film transistor of claim 1 , wherein the phase transition temperature is in the range of from 100 to 240° C.
6 . The organic thin-film transistor of claim 1 , wherein the glass transition temperature is in the range of from 110 to 250° C.
7 . The organic thin-film transistor of claim 1 , wherein the organic thin-film transistor is manufactured by a process comprising the step of coating a solution or dispersion solution of at least one of the organic semiconducting materials on the support to form the organic semiconductor layer.
8 . The organic thin-film transistor of claim 1 , wherein one of the organic semiconducting materials is a π-conjugated polymer or oligomer.
9 . The organic thin-film transistor of claim 8 , wherein the π-conjugated polymer is a homopolymer or copolymer of thiophene and the π-conjugated oligomer is a homo-oligomer or co-oligomer of thiophene.
10 . The organic thin-film transistor of claim 9 , wherein the homopolymer or copolymer of thiophene is a homopolymer or copolymer containing a unit with two or more 3-alkylthiophene rings regioregularly connected in series, and the homo-oligomer or co-oligomer of thiophene is a homo-oligomer or co-oligomer containing a unit with two or more 3-alkylthiophene rings regioregularly connected in series.
11 . The organic thin-film transistor of claim 10 , wherein the alkyl group of the 3-alkylthiophene rings is an alkyl group having a carbon atom number of from 4 to 15.
12 . A manufacturing process of an organic thin-film transistor comprising a support and provided thereon, a gate electrode, an insulation layer, a source electrode, a drain electrode, and an organic semiconductor layer, the support comprising at least one of resins, and the organic semiconductor layer containing at least one of organic semiconducting materials, wherein a phase transition temperature of one of the organic semiconducting materials is not more than a glass transition point of one of the resins, the process comprising the steps of:
providing a solution or dispersion solution of the organic semiconducting material; and coating the solution or dispersion solution on the support or on the insulation layer to form the organic semiconductor layer.
13 . The manufacturing process of claim 12 , comprising the step of heat treating the organic semiconductor layer at a heating temperature between the phase transition temperature and the glass transition point.
14 . The manufacturing process of claim 13 , wherein the heating temperature is in the range of from 100 to 250° C.
15 . The manufacturing process of claim 13 , wherein the phase transition temperature is in the range of from 100 to 240° C.
16 . The manufacturing process of claim 13 , wherein the glass transition temperature is in the range of from 110 to 250° C.
17 . The manufacturing process of claim 12 , wherein one of the organic semiconducting materials is a π-conjugated polymer or oligomer.
18 . The manufacturing process of claim 17 , wherein the π-conjugated polymer is a homopolymer or copolymer of thiophene and the π-conjugated oligomer is a homo-oligomer or co-oligomer of thiophene.
19 . The manufacturing process of claim 18 , wherein the homopolymer or copolymer of thiophene is a homopolymer or copolymer containing a unit with two or more 3-alkylthiophene rings regioregularly connected in series, and the homo-oligomer or co-oligomer of thiophene is a homo-oligomer or co-oligomer containing a unit with two or more 3-alkylthiophene rings regioregularly connected in series.
20 . The manufacturing process of claim 19 , wherein the alkyl group of the 3-alkylthiophene rings is an alkyl group having a carbon atom number of from 4 to 15.Join the waitlist — get patent alerts
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