US2006048801A1PendingUtilityA1
Tungsten plug corrosion prevention method using gas sparged water
Individually held — no corporate assignee on recordPriority: Oct 28, 2003Filed: Nov 4, 2005Published: Mar 9, 2006
Est. expiryOct 28, 2023(expired)· nominal 20-yr term from priority
H10P 72/0424H10W 20/031H10P 70/273
44
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Claims
Abstract
Disclosed herein is a method of making integrated circuits. In one embodiment the method includes forming tungsten plugs in a integrated circuit and forming electrically conductive interconnect lines after formation of the tungsten plugs, wherein at least one tungsten plug is electrically connected to at least one electrically conductive interconnect line. Separate from the formation of the tungsten plugs and electrically conductive interconnect lines, a gas is introduced into a liquid. At least one electrically conductive interconnect line is then contacted with the gas introduced liquid.
Claims
exact text as granted — not AI-modified1 - 20 . (canceled)
21 . An apparatus comprising:
a first chamber for receiving a gas; a second chamber for receiving a liquid; a porous membrane separating the first and second chambers, wherein the porous membrane is configured to pass the gas from the first chamber into the second chamber so that the gas can dissolve into the liquid; a tube coupled between the second chamber and a nozzle, wherein the tube is configured to transmit the liquid with the gas dissolved therein; a substrate comprising:
a tungsten plug formed in a dielectric layer, and;
an electrically conductive interconnect line formed on the dielectric layer, wherein the tungsten plug is electrically connected to the electrically conductive interconnect line;
wherein the substrate is positioned relative to the nozzle so that the liquid, with the gas dissolved therein, transmitted through the tube and nozzle emerges from the nozzle and contacts the electrically conductive interconnect line.
22 . The apparatus of claim 21 wherein the porous membrane comprises pores having an average pore size of 0.05 microns.
23 . An apparatus comprising:
a chamber in which in which a gas can be introduced into a liquid to produce a gas sparged liquid; a device coupled to the chamber, wherein the device is configured to output gas sparged liquid produced in the chamber; a substrate comprising:
a tungsten plug formed in a dielectric layer, and;
an electrically conductive interconnect line formed on the dielectric layer, wherein the tungsten plug is electrically connected to the electrically conductive interconnect line;
wherein the substrate is positioned relative to the device so that gas sparged liquid outputted by the device contacts the electrically conductive interconnect line.
24 . The apparatus of claim 23 wherein the device comprises a tube coupled a nozzle, wherein the tube is configured to transmit the gas sparged liquid from the chamber to the nozzle.
25 . The apparatus of claim 23 further comprising first and second flow lines coupled to the manifold, wherein the first flow line is configured to transmit a gas to the chamber, wherein the second flow line is configured to transmit a liquid to the chamber, wherein the chamber is configured to receive the gas and liquid transmitted by the first and second flow lines.
26 . The apparatus of claim 23 further comprising a motor for rotating the substrate while it is positioned relative to the nozzle.
27 . The apparatus of claim 23 further comprising:
a gas source coupled to the first flow line, wherein the gas source is configured to store carbon dioxide; a liquid source coupled to the second flow line, wherein the liquid source is configured to store water.
28 . An apparatus comprising:
a chamber for dissolving a gas into a liquid; a device coupled to the chamber, wherein the device is configured to output the liquid with the gas dissolved therein; a substrate comprising:
a tungsten plug formed in a dielectric layer, and;
an electrically conductive interconnect line formed on the dielectric layer, wherein the tungsten plug is electrically connected to the electrically conductive interconnect line;
wherein the substrate is positioned relative to the device so that the liquid, with the gas dissolved therein, outputted from the device, contacts the electrically conductive interconnect line.
29 . The apparatus of claim 28 wherein the chamber comprises:
a first sub-chamber for receiving a gas; a second sub-chamber for receiving a liquid; a porous membrane separating the first and second sub-chambers, wherein the porous membrane is configured to pass the gas from the first sub chamber into the second sub-chamber so that the gas can dissolve into the liquid.
30 . The apparatus of claim 28 wherein the device comprises a tube and a nozzle, wherein the tube is coupled between the second sub-chamber and a nozzle, wherein the tube is configured to transmit the liquid with the gas dissolved therein to the nozzle
31 . The apparatus of claim 29 wherein the porous membrane comprises pores having an average pore size of 0.05 microns.
32 . The apparatus of claim 21 further comprising a motor for rotating the substrate while it is positioned relative to the nozzle.Join the waitlist — get patent alerts
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