Method for manufacturing grindstone corrector and grindstone, and grindstone corrector, and grindstone

Abstract

The present invention is to increase the flatness of the correcting surface of a grindstone corrector and the grinding surface of the grindstone, thereby enabling to give excellent sharpness to a cutting tool or the like. The present invention is characterized in that a plate-glass is used as a base of the grindstone corrector or a base of the grindstone, and a conductive thin film is formed on the plate-glass by a deposition process or the like, and grinding grain layer of diamond or the like is formed on the conductive thin film by an electrodeposition process. By utilizing the flatness of the plate-glass and employing the electrodeposition process, a grindstone corrector and a grindstone having a grinding grain layer of high flatness on the correcting surface or the grinding surface can be obtained.

1 . A method for manufacturing a grindstone corrector in which a grinding grain layer is formed by an electrodeposition process, comprising the steps of: preparing a plate-glass as a base of the grindstone corrector; forming a conductive thin film onto an upper surface of the plate-glass; and firmly attaching diamond grinding grains onto said conductive thin film by an electrodeposition process.  
   
   
       2 . A method for manufacturing a grindstone in which a grinding grain layer is formed by an electrodeposition process, comprising the steps of: preparing a plate-glass as a base of the grindstone; forming a conductive thin film onto an upper surface of said plate-glass; and firmly attaching a grinding grain layer onto said conductive thin film by an electrodeposition process.  
   
   
       3 . A grindstone corrector comprising a base made of a plate-glass, a conductive thin film covering an upper surface of said base, and a grinding grain layer including diamond grinding grains firmly attached onto said conductive thin film.  
   
   
       4 . A grindstone corrector according to  claim 3 , wherein the thickness of the conductive thin film is set to 0.01 μm to 1 μm.  
   
   
       5 . A grindstone comprising a base made of a plate-glass, a conductive thin film covering an upper surface of the base, and a grinding grain layer firmly attached onto said conductive thin film.  
   
   
       6 . A grindstone according to  claim 5 , wherein the thickness of the conductive thin film is set to 0.01 μm to 1 μm.