Ultrasonic sensor

Abstract

An ultrasonic sensor includes a plurality of converters and a protection component. The plurality of converters convert one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission. The plurality of converters are juxtaposed. The protection component protects each of the converters.

1 . An ultrasonic sensor comprising: 
 a plurality of conversion means for converting one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission, the plurality of conversion means being juxtaposed; and    protection means for protecting each of the conversion means.    
   
   
       2 . The ultrasonic sensor according to  claim 1 , wherein the protection means includes: 
 a protective film provided above each of the conversion means; and    a first gap provided between the protective film and the conversion means.    
   
   
       3 . The ultrasonic sensor according to  claim 2 , wherein 
 the first gap is filled with a filler selected from a liquid, a sol, and a gel.    
   
   
       4 . The ultrasonic sensor according to  claim 3 , further comprising a vent hole for bringing the first gap and exterior into communication with each other.  
   
   
       5 . The ultrasonic sensor according to  claim 2 , further comprising separation means for separating the conversion means and the first gap located above the conversion means and the protective film for each of the conversion means.  
   
   
       6 . The ultrasonic sensor according to  claim 2 , further comprising: 
 a housing member for housing each of the plurality of the conversion means therein;    a second gap surrounded by the housing member and the conversion means; and    a vent hole for bringing the second gap and exterior into communication with each other.    
   
   
       7 . The ultrasonic sensor according to  claim 6 , wherein 
 at least one of the conversion means is a transmission element for converting an electric signal into an ultrasonic wave for transmission.    
   
   
       8 . The ultrasonic sensor according to  claim 2 , further comprising: 
 a housing member for housing each of the plurality of conversion means therein; and    a second gap corresponding to a sealed space surrounded by the housing member and the conversion means.    
   
   
       9 . The ultrasonic sensor according to  claim 8 , wherein 
 the second gap is filled with a filler selected from a liquid, a sol, and a gel.    
   
   
       10 . The ultrasonic sensor according to  claim 8  or  9 , wherein 
 each of the conversion means is a receiving element for converting a received ultrasonic wave into an electric signal.    
   
   
       11 . The ultrasonic sensor according to  claim 2 , further comprising a transfer member for independently connecting each of the conversion means and the protective film with each other for each of the conversion means.  
   
   
       12 . The ultrasonic sensor according to  claim 1 , wherein: 
 the protection means comprises a protective member attached to and fixed in front of each of the plurality of conversion means;    the protective member is provided for each of the conversion means;    a clearance is provided between the protective members; and    the clearance serves to separate the protective members from each other for each of the conversion means.    
   
   
       13 . The ultrasonic sensor according to  claim 1 , further comprising an acoustic horn provided in front of each of the plurality of conversion means, wherein the acoustic horn is provided for each of the conversion means so as to have a gradually increasing sectional area from a throat provided in front of each of the conversion means toward an opening.  
   
   
       14 . The ultrasonic sensor according to  claim 1 , wherein: 
 each of the conversion means is formed on a surface of a semiconductor substrate;    the surface side of the semiconductor substrate is regarded as the top side of each of the conversion means so as to serve as any one of a receiving surface and a transmission surface of an ultrasonic wave;    a bonding wire is connected to the surface side of the semiconductor substrate; and    each of the conversion means is surface-mounted on a sensor substrate by a wire bonding method through the bonding wire.    
   
   
       15 . The ultrasonic sensor according to  claim 1 , wherein 
 each of the conversion means is formed on a surface of a semiconductor substrate;    a bottom side of the semiconductor substrate is regarded as the top side of each the conversion means so as to serve as any one of a receiving surface and a transmission surface of an ultrasonic wave;    a bump is connected to the surface side of the semiconductor substrate; and    each of the conversion means is surface-mounted on a sensor substrate by flip-chip connection through the bump.    
   
   
       16 . The ultrasonic sensor according to  claim 1 , wherein each of the conversion means is any one of a piezoelectric conversion type and a capacitive conversion type.  
   
   
       17 . An ultrasonic sensor comprising: 
 a plurality of converters for converting one of a received ultrasonic wave into an electric signal and an electric signal into an ultrasonic wave for transmission, the plurality of converters being juxtaposed; and    a protection component for protecting each of the converters.    
   
   
       18 . The ultrasonic sensor according to  claim 17 , wherein the protection component includes: 
 a protective film provided above each of the converters; and    a first gap provided between the protective film and the converters.    
   
   
       19 . The ultrasonic sensor according to  claim 18 , wherein 
 the first gap is filled with a filler selected from a liquid, a sol, and a gel.    
   
   
       20 . The ultrasonic sensor according to  claim 19 , further comprising a vent hole for bringing the first gap and exterior into communication with each other.  
   
   
       21 . The ultrasonic sensor according to  claim 18 , further comprising a separating member for separating the converters and the first gap located above the converters and the protective film for each of the converters.  
   
   
       22 . The ultrasonic sensor according to  claim 18 , further comprising: 
 a housing member for housing each of the plurality of the converters therein;    a second gap surrounded by the housing member and the converters; and    a vent hole for bringing the second gap and exterior into communication with each other.    
   
   
       23 . The ultrasonic sensor according to  claim 22 , wherein 
 at least one of the converters is a transmission element for converting an electric signal into an ultrasonic wave for transmission.    
   
   
       24 . The ultrasonic sensor according to  claim 18 , further comprising: 
 a housing member for housing each of the plurality of converters therein; and    a second gap corresponding to a sealed space surrounded by the housing member and the converters.    
   
   
       25 . The ultrasonic sensor according to  claim 24 , wherein 
 the second gap is filled with a filler selected from a liquid, a sol, and a gel.    
   
   
       26 . The ultrasonic sensor according to  claim 24 , wherein 
 each of the converters is a receiving element for converting a received ultrasonic wave into an electric signal.    
   
   
       27 . The ultrasonic sensor according to  claim 18 , further comprising a transfer member for independently connecting each of the converters and the protective film with each other for each of the converters.  
   
   
       28 . The ultrasonic sensor according to  claim 17 , wherein: 
 the protection component includes a protective member attached to and fixed in front of each of the plurality of converters;    the protective member is provided for each of the converters;    a clearance is provided between the protective members; and    the clearance serves to separate the protective members from each other for each of the converters.    
   
   
       29 . The ultrasonic sensor according to  claim 17 , further comprising an acoustic horn provided in front of each of the plurality of converters, wherein the acoustic horn is provided for each of the converters so as to have a gradually increasing sectional area from a throat provided in front of each of the converters toward an opening.  
   
   
       30 . The ultrasonic sensor according to  claim 17 , wherein: 
 each of the converters is formed on a surface of a semiconductor substrate;    the surface side of the semiconductor substrate is regarded as the top side of each of the converters so as to serve as any one of a receiving surface and a transmission surface of an ultrasonic wave;    a bonding wire is connected to the surface side of the semiconductor substrate; and    each of the converters is surface-mounted on a sensor substrate by a wire bonding method through the bonding wire.    
   
   
       31 . The ultrasonic sensor according to  claim 17 , wherein 
 each of the converters is formed on a surface of a semiconductor substrate;    a bottom side of the semiconductor substrate is regarded as the top side of each the converters so as to serve as any one of a receiving surface and a transmission surface of an ultrasonic wave;    a bump is connected to the surface side of the semiconductor substrate; and    each of the converters is surface-mounted on a sensor substrate by flip-chip connection through the bump.    
   
   
       32 . The ultrasonic sensor according to  claim 17 , wherein each of the converters is any one of a piezoelectric conversion type and a capacitive conversion type.