Method for plating resin material

Abstract

This invention provides a method for plating a resin material that improves adhesion strength between a resin material and a plated metal layer and reduces the cost incurred by plating. This method comprises a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.

1 . A method for plating a resin material comprising a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.  
   
   
       2 . The method according to  claim 1 , which further comprises a step of alkaline degreasing of the surface of the resin material between the step of treating a resin material with ozone water and the step of permitting the resin material to adsorb a metal catalyst.  
   
   
       3 . The method according to  claim 1 , which further comprises a step of chemical plating following the step of permitting the resin material to adsorb a metal catalyst.  
   
   
       4 . The method according to  claim 3 , which comprises a step of electroplating following the step of chemical plating.  
   
   
       5 . The method according to  claim 1 , which comprises a step of electroplating following the step of permitting the resin material to adsorb a metal catalyst without the step of chemical plating.  
   
   
       6 . The method according to  claim 1 , wherein the ozone content in the ozone water is 50 ppm or higher.  
   
   
       7 . The method according to  claim 1 , wherein the duration of ozone water treatment is between 2 minutes and 10 minutes.  
   
   
       8 . The method according to  claim 1 , wherein the metal catalyst is a silver catalyst.  
   
   
       9 . Automobile parts plated by the method for plating a resin material comprising a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.  
   
   
       10 . Electric parts plated by the method for plating a resin material comprising a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.  
   
   
       11 . A method for plating printed circuit boards comprising plating the through holes and/or via holes of the printed circuit boards by the method for plating a resin material comprising a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.  
   
   
       12 . Printed circuit boards plated by the method for plating a resin material comprising a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.