Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment

Abstract

A method of manufacturing a semiconductor device includes (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode and (b) applying an adhesive to the inside of the first opening.

1 . A method of manufacturing a semiconductor device, comprising: 
 (a) fixing a cover onto a semiconductor substrate so as to place a surface of the cover that includes a portion defining a first opening, face to face on a surface of the semiconductor substrate that includes an electrode; and    (b) applying an adhesive inside the first opening.    
   
   
       2 . The method of manufacturing a semiconductor device according to  claim 1 , further comprising: 
 forming a translucent portion in at least a part of the cover; forming an optical unit on the semiconductor substrate;    fixing the cover onto the semiconductor substrate so as to provide the    first opening of the cover on a portion of the semiconductor substrate other than the optical unit, and to provide the translucent portion on the optical unit as defined in step (a); and    sealing the optical unit as defined in steps (a) and (b).    
   
   
       3 . The method of manufacturing a semiconductor device according to  claim 2 , further comprising: 
 forming a portion defining a second opening in the surface of the cover that includes the portion defining the first opening; and    fixing the cover onto the semiconductor substrate so as to provide the optical unit in the second opening as defined in step (a).    
   
   
       4 . The method of manufacturing a semiconductor device according to  claim 3 , further comprising providing the first opening so as to surround the second opening.  
   
   
       5 . The method of manufacturing a semiconductor device according to  claim 3 , further comprising: 
 forming an electrode on another surface of the semiconductor substrate; forming a portion defining a third opening in the surface of the cover    that includes the portion defining the first opening; and    fixing the cover onto the semiconductor substrate so as to provide the electrode in the third opening as defined in step (b).    
   
   
       6 . The method of manufacturing a semiconductor device according to  claim 5  further comprising providing the third opening so as to surround the first opening and the second opening.  
   
   
       7 . The method of manufacturing a semiconductor device according to  claim 1 , further comprising: 
 forming a portion defining a through-hole that extends from a back side of the surface that includes the portion defining the first opening to inside the first opening in the cover; and    applying the adhesive from the through-hole so as to provide the adhesive to the first opening as defined in step (b).    
   
   
       8 . The method of manufacturing a semiconductor device according to  claim 7 , further comprising. 
 forming a portion that is formed in line along the cover in the portion defining the first opening wherein the portion defining the through-hole is a slit that is formed in line on the portion of the first opening that is formed in line.    
   
   
       9 . The method of manufacturing a semiconductor device according to  claim 1 , further comprising: 
 forming the first opening so as to penetrate from one side of the cover to another side of the cover; and    applying the adhesive to the first opening from any one of the sides of the cover as defined in step (b).    
   
   
       10 . The method of manufacturing a semiconductor device according to  claim 2 , further comprising: 
 forming a plurality of portions that are each to be an optical chip that includes the optical unit in the semiconductor substrate; and    (d) dividing the semiconductor substrate into individual pieces of the optical chip where the optical unit is sealed.    
   
   
       11 . The method of manufacturing a semiconductor device according to  claim 10 , further comprising dividing the cover into individual pieces and removing a portion of the cover that faces the electrode.  
   
   
       12 - 23 . (canceled)