Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method

Abstract

A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defective soldering of the least one electronic part is tested by contacting a probe pin to various probe pin contact sections on the electronic circuit baseboard. During the step of soldering, the Pb excluded solder is also supplied to at least one of the various probe pin contact sections in order to suppress oxidation thereof.

1 - 16 . (canceled)  
   
   
       17 . An electronic circuit baseboard comprising: 
 a baseboard;    at least one electronic parts soldered to the baseboard with Pb-excluding solder; and    at least one conductive portion covered by Pb-excluding solder.    
   
   
       18 . The electronic circuit baseboard according to  claim 17 , wherein one of said Pb-excluding solders has a portion contacted by a test pin.  
   
   
       19 . The electronic circuit baseboard according to  claim 17 , wherein said Pb-excluding solder is an alloy including Sn—Ag—Cu.  
   
   
       20 . The electronic circuit baseboard according to one of  claim 17 , wherein Pb-excluding solder has substantially the same wetting performance to that of Pb-including solder.  
   
   
       21 . The electronic circuit baseboard according to  claim 17 , wherein a shape of one of the Pb-excluding solders substantially the same to the other one of the Pb-excluding solders.  
   
   
       22 . An electronic circuit baseboard comprising the electric circuit baseboard as claimed in any one of claims  17 - 21 .