US2006035573A1PendingUtilityA1
Polishing pad and method of making same
Est. expiryApr 5, 2024(expired)· nominal 20-yr term from priority
H10P 52/00B24D 3/00B24B 37/24B24D 3/28B24D 18/00B24D 3/32B24D 18/0009B24D 13/147B29C 44/3442
40
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Claims
Abstract
An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated mold and cured. The molded product is then removed from the mold and double side faced or ground to form a single thin polishing pad comprising a single layer of homogeneous material.
Claims
exact text as granted — not AI-modified1 . A nonporous polishing pad of uniform microcellular size produced by introducing a gas into a polymeric resin contained in a pressurized tank, pumping the polymeric resin and gas mixture through a fine porosity stone mixer, mixing the polymeric resin and gas mixture with an isocyanate to form a resulting mixture, and injecting the resulting mixture into a mold.
2 . The polishing pad of claim 1 wherein the polymeric resin and gas mixture are pumped through an emulsifier after being pumped through the fine porosity stone mixer.
3 . The polishing pad of claim 1 wherein the polymeric resin and gas mixture are passed through a homogenizing mixer after being pumped through the fine porosity stone mixer.
4 . The polishing pad of claim 1 wherein the gas is introduced into the polymeric resin through a sparging tube contained within the pressurized tank.
5 . The polishing pad of claim 4 wherein the polymeric resin and gas mixture are pumped through an emulsifier after being pumped through the fine porosity stone mixer.
6 . The polishing pad of claim 4 wherein the polymeric resin and gas mixture are passed through a homogenizing mixer after being pumped through the fine porosity stone mixer.
7 . The polishing pad of claim 1 wherein the polymeric resin and gas mixture are recirculated through the pressurized tank, containing a mixer, and the fine porosity stone mixer prior to mixing the polymeric resin and gas mixture with the isocyanate.
8 . The polishing pad of claim 1 wherein the uniform microcellular structure comprises a closed cell membrane having an average cell diameter within a range of about 0.05 to 100 micrometers.
9 . The polishing pad of claim 8 wherein the average cell diameter comprises a range of about 0.05 to 30 micrometers.
10 . The polishing pad of claim 1 wherein a surface material of the pad has a low coefficient of friction.
11 . The polishing pad of claim 1 wherein the polymeric matrix formed from the resulting mixture comprises at least one of a polyurethane, a polyester, a polysulfone, and a polyvinyl acetate.
12 . The polishing pad of claim 1 wherein said polymeric resin includes glycol as a catalyst.
13 . The polishing pad of claim 1 wherein said polymeric resin comprises at least one of a polyurethane, a polyglycol, a polyether polyol, a polymer polyol, an aliphatic polyester polyol, an aromatic polyester polyol, a PTMEG, a PTHF, a castor oil based polyol, a polycaprolactone polyol, a hydroxyl terminated polybutadiene, an acrylic polyol, and a polyamine.
14 . The polishing pad of claim 1 further comprising a porous transparent portion or porous translucent portion that is added to the pad subsequent to molding the pad.
15 . The polishing pad of claim 1 further comprising grooves formed in a surface of the pad.
16 . The polishing pad of claim 1 wherein the gas comprises at least one of an inert gas, a reactive gas, and a reductive gas.
17 . The polishing pad of claim 16 wherein the gas comprises at least one of a dry air, an argon gas, a dry nitrogen gas, and a dry oxygen gas.
18 . The polishing pad of claim 1 further comprising at least one of a surfactant and an ultraviolet stabilizer.
19 . A nonporous polishing pad of uniform microcellular size produced by introducing a gas into a polymeric resin through a recirculating pump which pumps the polymeric resin and gas mixture through a fine porosity stone mixer, mixing the polymeric resin and gas mixture with an isocyanate to form a resulting mixture, and injecting the resulting mixture into a mold.
20 . The polishing pad of claim 19 wherein the polymeric resin and gas mixture are pumped through an emulsifier after being pumped through the fine porosity stone mixer.
21 . The polishing pad of claim 19 wherein the polymeric resin and gas mixture are passed through a homogenizing mixer after being pumped through the fine porosity stone mixer.
22 . The polishing pad of claim 19 wherein the polymeric resin and gas mixture are recirculated through a pressurized tank having a mixer and the fine porosity stone mixer prior to mixing the polymeric resin and gas mixture with the isocyanate.
23 . The polishing pad of claim 19 wherein the uniform microcellular structure comprises a closed cell membrane having an average cell diameter within a range of about 0.05 to 100 micrometers.
24 . The polishing pad of claim 23 wherein the average cell diameter comprises a range of about 0.05 to 30 micrometers.
25 . The polishing pad of claim 19 wherein a surface material of the pad has a low coefficient of friction.
26 . The polishing pad of claim 19 wherein the polymeric matrix formed from the resulting mixture comprises at least one of a polyurethane, a polyester, a polysulfone, and a polyvinyl acetate.
27 . The polishing pad of claim 19 wherein said polymeric resin includes glycol as a catalyst.
28 . The polishing pad of claim 19 wherein said polymeric resin comprises at least one of a polyurethane, a polyglycol, a polyether polyol, a polymer polyol, an aliphatic polyester polyol, an aromatic polyester polyol, a PTMEG, a PTHF, a castor oil based polyol, a polycaprolactone polyol, a hydroxyl terminated polybutadiene, an acrylic polyol, and a polyamine.
29 . The polishing pad of claim 19 further comprising a porous transparent portion or a porous translucent portion that is added to the pad subsequent to molding the pad.
30 . The polishing pad of claim 1 9 further comprising grooves formed in a surface of the pad.
31 . The polishing pad of claim 19 wherein the gas comprises at least one of an inert gas, a reactive gas, and a reductive gas.
32 . The polishing pad of claim 31 wherein the gas comprises at least one of a dry air, an argon gas, a dry nitrogen gas, and a dry oxygen gas.
33 . The polishing pad of claim 19 further comprising at least one of a surfactant and an ultraviolet stabilizer.
34 . A method for making a nonporous polishing pad of uniform microcellular size comprising the steps of:
providing a polymeric resin contained in a pressurized tank having a mixer; introducing a gas into the polymeric resin; pumping the polymeric resin and gas mixture through a fine porosity stone mixer; mixing an isocyanate into the polymeric resin and gas mixture to form a resulting mixture; and injecting the resulting mixture into a mold.
35 . The method of claim 34 further comprising the steps of:
removing a formed pad from the mold; and grinding or facing at least one side of the pad to a desired thickness.
36 . The method of claim 34 further comprising the step of forming a window in the pad.
37 . The method of claim 36 wherein said window is formed by removing a portion of the pad and filling an opening created by the removed portion with a liquid polyurethane material that solidifies as a transparent portion or translucent portion of the pad.
38 . The method of claim 36 wherein said window is formed by removing a portion of the pad and filling an opening created by the removed portion with a solid transparent portion or translucent portion that is bonded to the pad.
39 . The method of claim 34 wherein the mold is an actuated mold which undergoes a reaction injection molding process.
40 . The method of claim 34 wherein an average cell size of the pad is controlled by applying a plurality of shearing forces to the polymeric resin and gas mixture prior to adding the isocyanate.
41 . A method for making a nonporous polishing pad of uniform microcellular size comprising the steps of:
providing a polymeric resin contained in a pressurized tank having a mixer; introducing a gas into the polymeric resin through a recirculating pump contained outside of the pressurized tank; pumping the polymeric resin and gas mixture through a fine porosity stone mixer with the recirculating pump; mixing an isocyanate into the polymeric resin and gas mixture to form a resulting mixture; and injecting the resulting mixture into a mold.
42 . The method of claim 41 further comprising the steps of:
removing a formed pad from the mold; and grinding or facing at least one side of the pad to a desired thickness.
43 . The method of claim 41 further comprising the step of forming a window in the pad.
44 . The method of claim 43 wherein said window is formed by removing a portion of the pad and filling an opening created by the removed portion with a liquid polyurethane material that solidifies as a transparent or translucent portion of the pad.
45 . The method of claim 43 wherein said window is formed by removing a portion of the pad and filling an opening created by the removed portion with a solid transparent portion or translucent portion that is bonded to the pad.
46 . The method of claim 41 wherein the mold is an actuated mold which undergoes a reaction injection molding process.
47 . The method of claim 41 wherein an average cell size of the pad is controlled by applying a plurality of shearing forces to the polymeric resin and gas mixture prior to adding the catalyst.
48 . The polishing pad of claim 1 wherein the polymeric resin and gas mixture are directed through a high shear cavitation device prior to adding the isocyanate.
49 . The polishing pad of claim 19 wherein the polymeric resin and gas mixture are directed through a high shear cavitation device prior to adding the isocyanate.
50 . The polishing pad of claim 1 further comprising hardware incorporated into the polishing pad during the molding process, or after the molding process by machining away a portion of the pad.
51 . The polishing pad of claim 19 further comprising hardware incorporated into the polishing pad during the molding process, or after the molding process by machining away a portion of the pad.
52 . The method of claim 34 further comprising the step of incorporating hardware into the polishing pad during the molding process, or after the molding process by machining away a portion of the pad.
53 . The method of claim 40 further comprising the step of incorporating hardware into the polishing pad during the molding process, or after the molding process by machining away a portion of the pad.Join the waitlist — get patent alerts
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