Self-aligned coil process in magnetic recording heads

Abstract

In one embodiment of the present invention, a write head includes a first pole P 1, a P 1 pedestal, a first back gap layer plated on top of the first pole P 1 leaving a region between the P 1 pedestal and the first back gap layer for plating a coil, a first insulation layer applied on top of the P 1 pedestal and the first back gap layer and the region between the P 1 pedestal and the first back gap layer. The write head further includes a coil, patterned at least partially on top of the P 1 pedestal and the first back gap layer and the region between the P 1 pedestal and the first back gap layer, copper plated in the coil patterns, and a second insulation layer applied to fill the spaces in between the coil turns. The resulting structure is planarized via chemical mechanical polishing.

1 . A method of manufacturing a write head comprising: 
 forming a P 1  pedestal and a first back gap layer on top of a first pole P 1  leaving a region therebetween for forming a coil, the first back gap layer formed at a distal end of the first pole P 1 ;    depositing a first insulation layer disposed over at least a portion of the P 1  pedestal, the first pole P 1  and the first back gap layer and the region;    forming a coil by depositing copper in coil pockets formed in a coil photoresist layer deposited over the first insulation layer, wherein the coil has multiple turns;    removing the coil photoresist layer to form spaces in between the coil turns; and    applying a second insulation layer to fill the spaces in between the coil turns.    
   
   
       2 . A method of manufacturing as recited in  claim 1 , further comprising: 
 removing excess deposited coil and photoresist layer to form a planar surface.    
   
   
       3 . A method of manufacturing as recited in  claim 1 , further comprising: 
 removing a coil seed layer before applying the second insulation layer, wherein the coil seed layer was deposited before applying the coil photoresist layer.    
   
   
       4 . A method of manufacturing as recited in  claim 1  wherein the first insulation layer is made of alumina.  
   
   
       5 . A method of manufacturing as recited in  claim 2  wherein the thickness of the first insulation layer behind the P 1  pedestal is in the range of 0.1 to 0.5 microns.  
   
   
       6 . A method of manufacturing as recited in  claim 1  wherein the coil is made of copper.  
   
   
       7 . A method of manufacturing as recited in  claim 1  wherein the thickness of each of the coil turns is in the range of 0.5 to 4 microns.  
   
   
       8 . A method of manufacturing as recited in  claim 1  wherein the coil is self-aligned with respect to the P 1  pedestal.  
   
   
       9 . A method of manufacturing as recited in  claim 1  wherein after the step of applying a second insulation layer, performing the step of hard baking to encapsulate the coil.  
   
   
       10 . A method of manufacturing as recited in  claim 9  further including the step of: 
 depositing alumina over the hard baked resist; and    performing a chemical mechanical polishing (CMP) process.    
   
   
       11 . A method of manufacturing as recited in  claim 1  further including the steps of: 
 depositing a write gap on top of the alumina after the chemical mechanical polishing step of  claim 10;     forming a P 2  pole tip on top of the write gap and at opposite end, a second back gap on top of the first back gap;    depositing alumina on the P 2  pole tip and the second back gap layer;    performing CMP process;    forming a second coil layer;    applying a third insulation layer on top of the second coil layer; and    forming a P 3  magnetic layer on top of the second coil layer extending from the P 2  pole tip to the second back gap layer.    
   
   
       12 . A structure formed in a write head comprising: 
 a first pole P 1 ;    a P 1  pedestal formed on top of the first pole P 1 ;    a first back gap layer plated on top of the first pole P 1  leaving a region between the P 1  pedestal and the first back gap layer for forming a coil;    a first insulation layer applied on top of the P 1  pedestal, P 1  pole and the region between the P 1  pedestal and the first back gap layer;    coil turns defined by a coil pattern that is self-aligned on top of the P 1  pedestal and the first back gap layer and the region between the P 1  pedestal and the first back gap layer, wherein the coil turns are formed in the coil patterns with spaces formed in between the coil turns; and    a second insulation layer applied to fill the spaces in between the coil turns.    
   
   
       13 . A structure as recited in  claim 10  further including a first insulation layer applied to the P 1  pedestal.  
   
   
       14 . A structure as recited in  claim 11  wherein the first insulation layer is made of Al 2 O 3 .  
   
   
       15 . A structure as recited in  claim 12  wherein the thickness of the first insulation layer behind the P 1  pedestal is in the range of 0.1 to 0.5 microns.  
   
   
       16 . A structure as recited in  claim 12  wherein the thickness of the first insulation layer in front of the back gap is in the range of 0.1 to 0.5 microns.  
   
   
       17 . A structure as recited in  claim 12  wherein the thickness of each of the coil turns is in the range of 0.5 to 4 microns.  
   
   
       18 . A structure as recited in  claim 10  wherein the coil is self-aligned.  
   
   
       19 . A disc drive comprising: 
 a write head including,    a first pole P 1 ;    a P 1  pedestal;    a first back gap layer plated on top of the first pole P 1  leaving a region between the P 1  pedestal and the first back gap layer for forming a coil;    a first insulation layer applied on top of the P 1  pedestal and the region between the P 1  pedestal and the first back gap layer;    coil pattern, defined by coil turns, self-aligned on top of the P 1  pedestal and the first back gap layer and the region between the P 1  pedestal and the first back gap layer, wherein the coil turns are formed in the coil patterns with spaces formed in between the coil turns; and    a second insulation layer applied to fill the spaces in between the coil turns.    
   
   
       20 . A writer comprising: 
 a first pole pedestal formed over a first end of a first pole;    a first back gap layer formed over second end of the first pole;    a first insulation layer at least partially covering the first pole pedestal and the back gap;    a first seed layer at least partially covering the first pole pedestal and the back gap;    coil patterns formed on top of the first seed layer; and    self-aligned coil plated into the coil patterns.    
   
   
       21 . A writer, as recited in  claim 18 , wherein the coil is encapsulated.  
   
   
       22 . A writer as recited in  claim 18  including a self-aligned second coil formed on top of a dielectric fill layer, the dielectric fill layer formed on top the pedestal and the back gap.  
   
   
       23 . A structure formed in a write head comprising: 
 a first pole P 1 ;    a P 1  pedestal formed on top of the first pole P 1 ;    a first back gap layer plated on top of the first pole P 1  leaving a region between the P 1  pedestal and the first back gap layer for plating a coil;    a first insulation layer applied on top of the P 1  pedestal and the region between the P 1  pedestal and the first back gap layer;    coil turns defined by a coil pattern formed on top of the region between the P 1  pedestal and the first back gap layer wherein the coil turns are formed in the coil patterns with spaces formed in between the coil turns; and    a second insulation layer applied to fill the spaces in between the coil turns, the conductivity of the area defined below the second insulation layer and above the first pole P 1  and extending between the P 1  pedestal and the first back gap layer increasing by 20 to 40%.    
   
   
       24 . A structure as recited in  claim 23  further including a first insulation layer applied to the P 1  pedestal.  
   
   
       25 . A structure as recited in  claim 24  wherein the first insulation layer is made of Al 2 O 3 .  
   
   
       26 . A structure as recited in  claim 24  wherein the thickness of the first insulation layer behind the P 1  pedestal is within the range of 0.1 to 0.5 microns.  
   
   
       27 . A structure as recited in  claim 24  wherein the thickness of the first insulation layer in front of the back gap is within the range of 0.1 to 0.5 microns.  
   
   
       28 . A structure as recited in  claim 23  wherein the thickness of each of the coil turns is in the range of 0.5 to 4 microns.  
   
   
       29 . A structure as recited in  claim 23  wherein the coil is self-aligned.