US2006033112A1PendingUtilityA1
Substrate for light emitting diodes
Est. expiryApr 15, 2022(expired)· nominal 20-yr term from priority
Inventors:Hiroto Isoda
H10W 90/754H10W 72/5363H10W 72/536H10W 72/0198H10H 20/8582H10H 20/8506H10H 20/857H10H 20/8585
42
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Claims
Abstract
A substrate has a pair of metal bases, and a first heat insulation layer disposed between the metal bases. A second heat insulation layer is securely mounted on the metal bases, and a pair of circuit patterns are securely mounted on the second heat insulation layer for mounting an LED.
Claims
exact text as granted — not AI-modified1 . A substrate comprising:
a pair of metal bases; a first electrical insulation layer disposed between the metal bases; a second electrical insulation layer securely mounted on the metal bases; and mounting means for mounting an LED on the substrate.
2 . The substrate according to claim 1 wherein the mounting means comprises a pair of circuit patterns securely mounted on the second electrical insulation layer, the LED is securely mounted on both the circuit patterns.
3 . The substrate according to claim 1 wherein the mounting means comprises a hole formed in the second electrical insulation layer to expose surfaces of metal bases, the LED is securely mounted on the metal bases.
4 . The substrate according to claim 2 further comprising upper and lower electrodes provided on an upper surface of the circuit patterns and on undersides of the metal bases.
5 . The substrate according to claim 2 wherein one of the metal bases is different from the other metal base in size of sectional shape.Join the waitlist — get patent alerts
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