Foam laminate system for semiconductor wafers

Abstract

A cushion-like device is provided for the transportation of semiconductor wafers. The device includes an interior formed from polyethylene closed cell foam that utilizes a foaming agent that imparts minimal alkanes and cations into the polyethylene foam material. An electrostatic discharge dissipative polyethylene film surrounds the foam interior and is joined thereto by hot melt EVA material. An array of apertures of approximately 0.010 inch diameter and less than 0.25 inch spacing is formed in the film to allow the foam to compress upon impact.

1 . A device for cushioning semiconductor wafer, comprising: 
 a foam interior; and    a film surrounding said foam interior, said film having antistatic characteristics and apertures to allow for compression of said foam interior upon impact.    
   
   
       2 . The device of  claim 1  wherein said foam interior comprises closed cell polyethylene foam.  
   
   
       3 . The device of  claim 2  wherein said closed cell polyethylene foam utilizes a foaming agent which imparts minimal alkanes and cations to said closed cell polyethylene foam.  
   
   
       4 . The device of  claim 1  wherein said foam interior is cylindrical with a thickness substantially in the range of one quarter to three eighths of an inch thick.  
   
   
       5 . The device of  claim 1  wherein said film is secured to said foam interior by hot melt material which is substantially free of cations and alkanes.  
   
   
       6 . The device of  claim 1  wherein said film is an electrostatic dissipative polyethylene.  
   
   
       7 . The device of  claim 6  wherein said film is approximately 0.003 inches thick.  
   
   
       8 . The device of  claim 7  wherein said apertures are approximately 0.010 inches in diameter and are spaced less than 0.25 inches apart.  
   
   
       9 . The device of  claim 1  wherein said film includes a plurality of pieces which are joined together by a seam formed by heat sealing.