US2006027923A1PendingUtilityA1

Coating process to enable electrophoretic deposition

Assignee: BHATIA TANIAPriority: Aug 9, 2004Filed: Aug 9, 2004Published: Feb 9, 2006
Est. expiryAug 9, 2024(expired)· nominal 20-yr term from priority
C04B 41/52C04B 41/009C04B 41/89C25D 13/02
45
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Claims

Abstract

The present invention relates to a process for the deposition of protective coatings on complex shaped Si-based substrates which are used in articles and structures subjected to high temperature, aqueous environments comprises a non-line-of-sight process, particularly, electrophoretic deposition (EPD) process.

Claims

exact text as granted — not AI-modified
1 - 13 . (canceled)  
     
     
         14 . A composite article comprising: 
 a Si-containing substrate;    an electrically conductive layer; and    a barrier layer.    
     
     
         15 . An article according to  claim 14 , further including an electrically insulating layer between the substrate and the electrically conductive layer.  
     
     
         16 . An article according to  claim 15 , further including a bond coat between the electrically conductive layer and the barrier layer.  
     
     
         17 . An article according to  claim 14 , wherein the article is complex shaped.  
     
     
         18 . An article according to  claim 17 , wherein the article is one of integral vane rings and integrally bladed rotors.  
     
     
         19 . An article according to  claim 18 , wherein the barrier layer is an EPD deposited barrier layer.  
     
     
         20 . An article according to  claim 15 , wherein the insulating layer is selected from the group consisting of SiC; Si 3 N 4 ; rare earth oxides; oxides of Y, Si, Hf, Zr, Nb, Ta, Ti; and mixtures thereof.  
     
     
         21 . An article according to  claim 20 , further including a bond coat between the electrically conductive layer and the barrier layer.  
     
     
         22 . An article according to  claim 21 , wherein the bond coat material is selected from the group consisting of Ta, Hf, Nb, Si, Mo, Ti, W, Al, Zr, Y, Cr and mixtures thereof.

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