Electromagnetic interference shielding filter and manufacturing method thereof

Abstract

An electromagnetic interference (EMI) shielding filter includes a conductive pattern for shielding electromagnetic waves; and blackened layers formed on a surface of the conductive pattern. The electromagnetic interference (EMI) shielding filter is manufactured by preparing a base film; forming on the base film a first blackened layer, a conductive layer, and a second blackened layer in sequence; and patterning the first blackened layer, the conductive layer, and the second blackened layer by using a same mask, and forming on front and rear surfaces of an EMI shielding layer a conductive pattern comprising the first and second blackened layers.

1 - 13 . (canceled)  
   
   
       14 . An electromagnetic interference (EMI) shielding filter, comprising: 
 a base film formed to have a predetermined transmittance;    an electromagnetic interference shielding layer formed on the base film, and being conductive mesh typed; and    a blackened layer formed on a surface of the electromagnetic interference shielding layer.    
   
   
       15 . The filter of  claim 14 , wherein the blackened layer is formed on front and rear surfaces of the EMI shielding layer.  
   
   
       16 . The filter of  claim 14 , wherein the blackened layer is formed on front, rear and side surfaces of the EMI shielding layer.  
   
   
       17 . The filter of  claim 14 , wherein the blackened layer is formed on front and side surfaces of the EMI shielding layer.  
   
   
       18 . The filter of  claim 14 , wherein the EMI layer is formed of metal.  
   
   
       19 . The filter of  claim 14 , wherein the conductive layer is comprised of at least one of copper (Cu) and argentum (Ag).  
   
   
       20 . The filter of  claim 14 , wherein the blackened layer is formed of metal oxide.  
   
   
       21 . The filter of  claim 14 , wherein the blackened layer is an oxide film formed of copper (Cu) or nickel (Ni), or an oxide film formed of alloy of copper (Cu) and nickel (Ni).  
   
   
       22 . The filter of  claim 14 , wherein the conductive layer is comprised of meshes and frames encompassing the meshes.  
   
   
       23 . A method for manufacturing an electromagnetic interference (EMI) shielding filter, the method comprising the steps of: 
 preparing a base file having a predetermined transmittance;    forming a first blackened layer on the base film;    forming a conductive layer on the first blackened layer;    forming a second blackened layer on the conductive layer; and    concurrently patterning the first blackened layer, the conductive layer, and the second blackened layer in a mesh type.    
   
   
       24 . The method of  claim 23 , wherein the first and second blackened layers are manufactured using at least one, or concurrently using at least two of a screen printing method, a chemical film coating method, and an electrochemical blackening method.  
   
   
       25 . The method of  claim 23 , wherein the conductive layer is formed using a deposition method.  
   
   
       26 . The method of  claim 25 , wherein the deposition method is a sputtering method.  
   
   
       27 . The method of  claim 23 , wherein in the patterning, meshes and frames encompassing the meshes are concurrently formed.  
   
   
       28 . A method for manufacturing an electromagnetic interference (EMI) shielding filter, the method comprising the steps of: 
 preparing a base file having a predetermined transmittance;    forming a first blackened layer on the base film;    forming a conductive layer on the first blackened layer;    concurrently patterning the first blackened layer and the conductive layer in a mesh type; and    forming a second blackened layer on an entire surface of the patterned conductive layer.    
   
   
       29 . The method of  claim 28 , wherein the first and second blackened layers are manufactured using at least one, or concurrently using at least two of a screen printing method, a film coating method, and an electrochemical blackening method.  
   
   
       30 . The method of  claim 28 , wherein the conductive layer is formed using a deposition method.  
   
   
       31 . The method of  claim 30 , wherein the deposition method is a sputtering method.  
   
   
       32 . The method of  claim 28 , wherein in the patterning, meshes and frames encompassing the meshes are concurrently formed.  
   
   
       33 . A method for manufacturing an electromagnetic interference (EMI) shielding filter, the method comprising the steps of: 
 preparing a base file having a predetermined transmittance;    forming a conductive layer on the base film;    patterning the conductive layer in a mesh type; and    forming a blackened layer on a surface of the patterned conductive layer.    
   
   
       34 . The method of  claim 33 , wherein the first and second blackened layers are manufactured using at least one, or concurrently using at least two of a screen printing method, a film coating method, and an electrochemical blackening method.  
   
   
       35 . The method of  claim 33 , wherein the conductive layer is formed using a deposition method.  
   
   
       36 . The method of  claim 35 , wherein the deposition method is a sputtering method.  
   
   
       37 . The method of  claim 33 , wherein in the patterning, meshes and frames encompassing the meshes are concurrently formed.  
   
   
       38 . A plasma display panel having a front substrate and a rear substrate, the panel comprising: 
 an electromagnetic interference (EMI) shielding filter comprising:    a base film formed on the front substrate to have a predetermined transmittance;    a conductive layer patterned in a mesh type on the base film; and    a blackened layer formed on a surface of the conductive layer.    
   
   
       39 . The panel of  claim 38 , wherein the blackened layer is formed on front and rear surfaces of the conductive layer.  
   
   
       40 . The panel of  claim 38 , wherein the blackened layer is formed on front, rear and side surfaces of the conductive layer.  
   
   
       41 . The panel of  claim 38 , wherein the blackened layer is formed on front and side surfaces of the conductive layer.  
   
   
       42 . The panel of  claim 38 , wherein the EMI layer is formed of metal.  
   
   
       43 . The panel of  claim 38 , wherein the conductive layer is comprised of at least one of copper (Cu) and argentum (Ag).  
   
   
       44 . The panel of  claim 38 , wherein the base film is formed of PET (Polyetylene Terephthalate).  
   
   
       45 . The panel of  claim 38 , wherein the blackened layer is formed of metal oxide.  
   
   
       46 . The panel of  claim 38 , wherein the blackened layer is an oxide film formed of copper (Cu) or nickel (Ni), or an oxide film formed of alloy of copper (Cu) and nickel (Ni).  
   
   
       47 . The panel of  claim 38 , wherein the conductive layer is comprised of meshes and frames encompassing the meshes.  
   
   
       48 . The panel of  claim 38 , wherein at least one of an antireflective film and a near infrared ray shielding film is further formed on the front substrate.  
   
   
       49 . The panel of  claim 38 , wherein at least one of an antireflective film and a near infrared ray shielding film is further formed on the base film.  
   
   
       50 . The panel of  claim 38 , wherein the base film is adhered to the electromagnetic interference shielding filter.  
   
   
       51 . The panel of  claim 38 , wherein a color correction film is further formed at the front substrate.