US2006021903A1PendingUtilityA1

System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking

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Individually held — no corporate assignee on recordPriority: Jan 23, 2004Filed: Sep 29, 2005Published: Feb 2, 2006
Est. expiryJan 23, 2024(expired)· nominal 20-yr term from priority
Inventors:Paul G PerreaultDouglas ClarkKjell A Heitmann
H05K 2201/0999H05K 1/0275H05K 1/147H05K 2201/10151G08B 13/128H05K 1/0203
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Claims

Abstract

A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.

Claims

exact text as granted — not AI-modified
1 . A tamper protected printed circuit board assembly, comprising: 
 a printed circuit board, said printed circuit board having a plurality of electronic components mounted on a first side thereof;    a tamper wrap at least partially covering said printed circuit board;    a thermally conductive material located between said first side of printed circuit board and a first portion of said tamper wrap, said plurality of electronic components being in thermal contact with said first portion of said tamper wrap through said thermally conductive material; and    an enclosing case for enclosing said printed circuit board and said tamper wrap, said enclosing case being in thermal contact with said first portion of said tamper wrap.    
   
   
       2 . A printed circuit board assembly according to  claim 1 , said enclosing case comprising a metal.  
   
   
       3 . A printed circuit board assembly according to  claim 2 , said metal being aluminum.  
   
   
       4 . A printed circuit board assembly according to  claim 2 , said metal being zinc.

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