Substrate mounting apparatus and control method of substrate temperature

Abstract

A substrate mounting apparatus, comprises a ceramic base having a substrate mounting surface, and a jointing layer, which is formed on an opposite surface to the substrate mounting surface of the ceramic base, and has jointing materials differing in a thermal conductivity by in-plane regions and arranged in the regions.

1 . A substrate mounting apparatus, comprising: 
 a ceramic base having a substrate mounting surface; and    a jointing layer, which is formed on an opposite surface to the substrate mounting surface of the ceramic base, and has jointing materials differing in a thermal conductivity by in-plane regions and arranged in the regions.    
   
   
       2 . The substrate mounting apparatus according to  claim 1 , further comprising a pedestal joined to the ceramic base with the jointing layer interposed between the pedestal and the ceramic base.  
   
   
       3 . The substrate mounting apparatus according to  claim 1 , wherein 
 the regions are a central part and a peripheral part;    a first jointing material is arranged in the central part; and    a second jointing material differing in the thermal conductivity from the first jointing material is arranged in the peripheral part.    
   
   
       4 . The substrate mounting apparatus according to  claim 3 , wherein the second jointing material has a higher thermal conductivity than a thermal conductivity of the first jointing material.  
   
   
       5 . The substrate mounting apparatus according to  claim 1 , wherein the jointing materials include a resin base material and filler  
   
   
       6 . The substrate mounting apparatus according to  claim 1 , further comprising an electrostatic chuck electrode buried in the ceramic base.  
   
   
       7 . The substrate mounting apparatus according to  claim 1 , further comprising a resistance heating element buried in the ceramic base.  
   
   
       8 . The substrate mounting apparatus according to  claim 2 , wherein the pedestal includes a cooling unit.  
   
   
       9 . The substrate mounting apparatus according to  claim 1 , wherein 
 the ceramic base has protrusions on the substrate mounting surface, and    contact area of each of the protrusions with a mounted substrate differs by the regions.    
   
   
       10 . The substrate mounting apparatus according to  claim 9 , wherein the contact area is larger in a peripheral part than in a central part of the substrate mounting surface.  
   
   
       11 . The substrate mounting apparatus according to  claim 9 , wherein the contact area is larger in a central part than in a peripheral part of the substrate mounting surface.  
   
   
       12 . A control method of substrate temperature, comprising: 
 controlling temperature distribution of a substrate mounted on a ceramic base by controlling in-plane thermal conductivity distribution of a jointing layer formed on an opposite surface to a substrate mounting surface of the ceramic base.    
   
   
       13 . The control method according to  claim 12 , wherein controlling the in-plane thermal conductivity distribution of the jointing layer by arranging a first jointing material in a central part of the jointing layer and a second jointing material differing in a thermal conductivity from the first jointing material in a peripheral part of the jointing layer.  
   
   
       14 . The control method according to  claim 12 , wherein controlling the temperature distribution of the substrate by controlling contact areas of respective protrusions formed on the substrate mounting surface with the substrate by location.