[high-performance two-phase flow evaporator]

Abstract

A high-performance two-phase flow evaporator is disclosed to include an electronic device, a non-metal casing, a heat sink device provided at the topside of the non-metal casing and defining with the non-metal casing an enclosed chamber, a working fluid contained in the enclosed chamber, and a heat conductivity member formed of higher heat conductivity material (k>100 W/m.K) in the bottom side of the non-metal casing and disposed in contact between the electronic device and the working fluid for transferring heat energy from the electronic device to the working fluid to heat the working fluid to give off steam so that heat energy is quickly dissipated from the electronic device into the outside open air through the heat sink device.

1 . A high-performance two-phase flow evaporator comprising: 
 an electronic device;    a non-metal casing mounted on said electronic device at a topside;    a metal heat sink device provided at a topside of said non-metal casing and defining with said non-metal casing an enclosed chamber;    a working fluid contained in said enclosed chamber; and    a heat conductivity member formed of higher heat conductivity material (k>100 W/m.K) in a bottom wall of said non-metal casing, said heat conductivity member having a bottom contact surface disposed in contact with said electronic device and adapted to absorb heat energy from said electronic device during operation of said electronic device and a top heating surface disposed in contact with said working fluid and adapted to transfer heat energy from said bottom contact surface to said working fluid to heat said working fluid.    
   
   
       2 . The high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said heat conductivity member defines with said non-metal casing a recessed hole that accommodates said electronic device.  
   
   
       3 . The high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said electronic device is a CPU (central processing unit).  
   
   
       4 . The high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said metal heat sink device comprises a flat base that covers a top side of said non-metal casing, and a plurality of radiation fins upwardly extended from a top wall of said flat base.  
   
   
       5 . The high-performance two-phase flow evaporator as claimed in  claim 4 , wherein said flat base of said heat sink device has a corrugated top surface to increase contact area and to further accelerating condensing of steam in fluid.  
   
   
       6 . The high-performance two-phase flow evaporator as claimed in  claim 4 , wherein said flat base of said heat sink device has a serrated top surface to increase contact area and to further accelerating condensing of steam in fluid.  
   
   
       7 . The high-performance two-phase flow evaporator as claimed in  claim 4 , wherein said radiating fins further comprise an electric fan.  
   
   
       8 . The high-performance two-phase flow evaporator as claimed in  claim 4 , wherein said flat base has a capillary structure in a top surface thereof to increase the contact area to accelerate liquid-vapor phase changing speed.  
   
   
       9 . The high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said enclosed chamber further comprise a steam guide means and adapted to guide steam from said working fluid to said heat sink device.  
   
   
       10 . The high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said non-metal casing is made of plastics.  
   
   
       11 . The high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said non-metal casing is made of ceramics.  
   
   
       12 . The high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said higher heat conductivity material (k>100 W/m.K) of said heat conductivity member is a metal material selected from a metal material group including simplex element and complex of silver, copper and aluminum.  
   
   
       13 . The e high-performance two-phase flow evaporator as claimed in  claim 1 , wherein said higher heat conductivity material (k>100 W/m.K) of said heat conductivity member is selected from a material groups including graphite, silicon carbide, aluminum nitride, boron nitride, aluminum and silicon carbide complex, graphite and copper complex, graphite and aluminum complex.