Device for mounting a semiconductor package on a support plate via a base

Abstract

A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.

1 . A device for mounting a semiconductor package on a support plate, comprising: 
 a base inserted between a rear face of the semiconductor package and a front face of the said support plate;    means, passing through the base, for electrically connecting the semiconductor package to the support plate; and    means for fastening the semiconductor package onto the support plate, wherein the means for fastening cooperates with and is placed below the rear face of the semiconductor package.    
     
     
         2 . The device according to  claim 1 , wherein the rear face of the semiconductor package has at least one part projecting towards the support plate and in that the means for fastening cooperates with this projecting part and wherein the projecting part from the semiconductor package extends through the base and is adhesively bonded to the support plate.  
     
     
         3 . The device according to  claim 1 , further comprising: 
 a fastening lug which passes through the support plate and the base, this lug having a shoulder away from the base and bearing on a rear face of the support plate and being fastened to the rear face of the semiconductor package.    
     
     
         4 . The device according to  claim 4 , wherein the lug is fastened to the semiconductor package by adhesive bonding.  
     
     
         5 . The device according to  claim 1 , wherein the semiconductor package and the base include complementary centering parts engaging with each other.  
     
     
         6 . The device according to  claim 1 , wherein the semiconductor package and the base have peripheries which substantially correspond.  
     
     
         7 . A semiconductor product, comprising: 
 a semiconductor package securing an integrated circuit, the semiconductor package having a rear face surface;    a peripheral rib member projecting rearwardly from the rear face surface;    a mounting base; and    a peripheral latch mechanism associated with the mounting base, the peripheral latch mechanism engaging the peripheral rib member to retain the semiconductor package to the mounting base.    
     
     
         8 . The product as in  claim 7  further including a printed circuit support plate to which the mounting base is attached.  
     
     
         9 . The product as in  claim 8  further including electrical interconnection structure in the mounting base for electrically connecting the semiconductor package to the printed circuit support plate.  
     
     
         10 . The product as in  claim 7  wherein the integrated circuit comprises an optical semiconductor component.  
     
     
         11 . The product as in  claim 10  further including a transparent plate overlying a front face surface of the semiconductor package to optically expose the optical semiconductor component.  
     
     
         12 . The product as in  claim 11  further including: 
 a front plate bonded to the transparent plate, the front plate including a central passage therein; and    an optical lens mounted within the central passage.    
     
     
         13 . The product as in  claim 7  wherein the peripheral latch mechanism comprises a plurality of deformable holding catches which engage the peripheral rib member.  
     
     
         14 . A semiconductor product, comprising: 
 a semiconductor package securing an integrated circuit, the semiconductor package having a rear face surface and a boss member projecting rearwardly therefrom;    a mounting base including an aperture sized and shaped to receive the rearwardly projecting boss member; and    an adhesive layer engaging the boss member to retain the semiconductor package in the mounting base when the rearwardly projecting boss member is inserted into the aperture.    
     
     
         15 . The product as in  claim 14  further including a printed circuit support plate to which the mounting base is attached.  
     
     
         16 . The product as in  claim 15  further including electrical interconnection structure in the mounting base for electrically connecting the semiconductor package to the printed circuit support plate.  
     
     
         17 . The product as in  claim 15  wherein the adhesive layer engaging the boss member further engages the printed circuit support plate.  
     
     
         18 . The product as in  claim 14  wherein the integrated circuit comprises an optical semiconductor component.  
     
     
         19 . The product as in  claim 18  further including a transparent plate overlying a front face surface of the semiconductor package to optically expose the optical semiconductor component.  
     
     
         20 . The product as in  claim 19  further including: 
 a front plate bonded to the transparent plate, the front plate including a central passage therein; and    an optical lens mounted within the central passage.    
     
     
         21 . A semiconductor product, comprising: 
 a semiconductor package securing an integrated circuit, the semiconductor package having a rear face surface;    a mounting base having a front and back surface and including an aperture, the semiconductor package positioned with its rear face surface adjacent the front surface of the mounting base;    a holding lug inserted from the back surface of the mounting base, and through the aperture therein, into a position adjacent the rear face surface of the semiconductor package; and    an adhesive layer between the holding lug and rear face surface of the semiconductor package to retain the semiconductor package adjacent the mounting base.    
     
     
         22 . The product as in  claim 21  further including a printed circuit support plate to which the mounting base is attached.  
     
     
         23 . The product as in  claim 22  further including electrical interconnection structure in the mounting base for electrically connecting the semiconductor package to the printed circuit support plate.  
     
     
         24 . The product as in  claim 22  wherein the printed circuit support plate further includes a passage through which the holding lug is inserted.  
     
     
         25 . The product as in  claim 21  wherein the integrated circuit comprises an optical semiconductor component.  
     
     
         26 . The product as in  claim 25  further including a transparent plate overlying a front face surface of the semiconductor package to optically expose the optical semiconductor component.  
     
     
         27 . The product as in  claim 26  further including: 
 a front plate bonded to the transparent plate, the front plate including a central passage therein; and    an optical lens mounted within the central passage.    
     
     
         28 . A device for mounting a semiconductor package to a supporting base, the supporting base being mounted to a printed circuit board, comprising: 
 means for fastening the semiconductor package onto the supporting base, wherein the means for fastening cooperates with and is placed below a rear face of the semiconductor package; and    means for making an electrical connection from the printed circuit board to the semiconductor package wherein the electrical connection extends through the supporting base.    
     
     
         29 . The device according to  claim 28 , wherein the projecting member extends through an aperture in the supporting base and is adhesively bonded to the printed circuit board.  
     
     
         30 . The device according to  claim 28 , wherein the projecting member is adhesively bonded to the supporting base fastened to the support plate.  
     
     
         31 . The device according to  claim 28 , further comprising: 
 a fastening lug which passes through an aperture in the printed circuit board and the supporting base, this lug having a shoulder away from the supporting base and bearing on a rear face of the printed circuit board and being fastened to the rear face of the semiconductor package.    
     
     
         32 . The device according to  claim 31 , wherein the lug is fastened to the semiconductor package by adhesive bonding.  
     
     
         33 . The device according to  claim 28 , wherein the semiconductor package and the supporting base include complementary centering parts engaging with each other.  
     
     
         34 . The device according to  claim 28 , wherein the semiconductor package and the supporting base have peripheries which substantially correspond.