Packaging system and method for storing electronic components

Abstract

A packaging system and methods are disclosed for protecting an electronic component and the cavity of a carrier tape. The packaging system includes a cover tape having a protective layer and a film layer attached thereto. A method for protecting components positioned in the cavities of a carrier tape includes attaching a compressible protective layer to a first surface of the cover tape facing away from the cavity, and sealing the cover tape on at least a pair of bonding zones of the carrier tape.

1 . A packaging system for protecting an electronic component placed in a cavity of a carrier tape, comprising: 
 a cover tape having a first surface facing away from the cavity and a second surface facing toward said cavity;    a carrier tape having a cavity that includes a floor and a wall structure extending from the floor; and    a protective layer attached to the first surface of the cover tape wherein said protective layer protects an electronic component stored within the cavity against excessive physical impact.    
     
     
         2 . The packaging system of  claim 1 , wherein said protective layer is attached to the cover tape in a longitudinal direction.  
     
     
         3 . The packaging system of  claim 1 , wherein the protective layer is attached to the first surface of the cover tape along a center portion of the cover tape.  
     
     
         4 . The packaging system of  claim 1 , further comprising a film layer above said protective layer.  
     
     
         5 . The packaging system of  claim 4 , wherein said film layer and said cover tape are fabricated from the same material.  
     
     
         6 . The packaging system of  claim 1 , wherein the cover tape comprises a material selected from the group consisting of polyester, polypropylene, and polyethylene.  
     
     
         7 . The packaging system according to  claim 1 , wherein the carrier tape comprises a material selected from the group consisting of thermoplastic resin, polycarbonate, polystyrene, and acrylonitrile butadiene-styrene.  
     
     
         8 . The packaging system of  claim 1 , wherein said protective layer comprises a transparent material.  
     
     
         9 . The packaging system of  claim 1 , wherein said protective layer is selected from the group consisting of foam, gel, rubber and a combination thereof.  
     
     
         10 . The packaging system of  claim 9 , wherein said foam comprises a material selected from the group consisting of polyether, polyester, PVC, neoprene, and sponge.  
     
     
         11 . A method for protecting a plurality of components positioned in a respective plurality of cavities of a carrier tape, the method comprising: 
 placing each of the plurality of components in a different one of the plurality of cavities of the carrier tape;    attaching a compressible protective layer to a first surface of the cover tape in a longitudinal direction, said first surface facing away from the cavity; and    sealing the cover tape on at least a pair of bonding zones, each zone of the pair of bonding zones disposed in a longitudinal direction of the carrier tape on opposite sides of the cavities.    
     
     
         12 . The method according to  claim 11 , wherein the carrier tape is made from one of thermoplastic resin, polycarbonate, polystyrene, and acrylonitrile butandiene-styrene.  
     
     
         13 . The method according to  claim 11 , wherein the cover tape is made from one of polyester, polypropylene, and polyethylene.  
     
     
         14 . The method of  claim 11 , wherein sealing comprises applying heat or pressure to the bonding zones.  
     
     
         15 . The method of  claim 11  further comprising attaching a film layer to an exposed side of the protective layer.  
     
     
         16 . The method according to  claim 15 , the protective layer is attached to a center portion on the first surface of the cover tape.  
     
     
         17 . The method of  claim 11 , wherein the protective layer comprises a material selected from the group consisting of a polyether, polyester, PVC, neoprene, gel and sponge.  
     
     
         18 . The method according to  claim 11 , wherein the protective layer comprises a material having electrostatic dissipating properties.  
     
     
         19 . A method for protecting an electronic component placed in a cavity of a carrier tape, covered by a cover tape comprising: 
 attaching a protective layer to a first surface of the cover tape, said first surface facing away from the cavity;    placing a plurality of components in a respective plurality of cavities; and    wounding the cover tape, the protective layer, and the carrier tape on a tape receiving device.    
     
     
         20 . The method according to  claim 19 , wherein the carrier tape is made from one of thermoplastic resin, polycarbonate, polystyrene, and acrylonitrile butandiene-styrene.  
     
     
         21 . The method according to  claim 19 , wherein the cover tape is made from one of polyester, polypropylene, and polyethylene.  
     
     
         22 . The method of  claim 19  further comprising attaching a film layer to an exposed side of the protective layer.  
     
     
         23 . The method according to  claim 19 , the protective layer is attached to a center portion  
     
     
         21 . The method according to  claim 19 , wherein the cover tape is made from one of polyester, polypropylene, and polyethylene.  
     
     
         22 . The method of  claim 19  further comprising attaching a film layer to an exposed side of the protective layer.  
     
     
         23 . The method according to  claim 19 , the protective layer is attached to a center portion on the first surface of the cover tape.  
     
     
         24 . The method of  claim 19 , wherein the protective layer comprises a material selected from the group consisting of a polyether, polyester, PVC, neoprene, gel and sponge.  
     
     
         25 . The method according to  claim 19 , wherein the protective layer comprises a material having electrostatic dissipating properties.  
     
     
         26 . The method of  claim 19 , wherein the protective layer is transparent.  
     
     
         27 . The method of  claim 19 , wherein the cover tape has a thickness of about 0.04 to 0.06 mm.  
     
     
         28 . The method of  claim 19 , wherein a film layer is provided on an exposed upper surface of the protective layer.