Silicon building block architecture with flex tape

Abstract

An apparatus is constituted with an integrated circuit and a flex tape coupled to the integrated circuit. The flex tape is employed to facilitate ingress/egress of signals to/from the integrated circuit. In one embodiment, the flex tape includes a plurality of signal-traces. In another embodiment, the apparatus also includes a silicon interposer coupled to the flex tape and a substrate coupled to the silicon interposer.

1 . An apparatus comprising: 
 an integrated circuit;    a board coupled to said integrated circuit; and    a flexible power delivery substrate electrically coupled to said board and said integrated circuit.    
   
   
       2 . The apparatus of  claim 1  wherein said board comprises one or more power conduits.  
   
   
       3 . The apparatus of  claim 1  wherein said integrated circuit is mounted to said board.  
   
   
       4 . The apparatus of  claim 1  wherein said integrated circuit is mounted to a bottom side of said board.  
   
   
       5 . The apparatus of  claim 1  further comprising land side capacitors coupled to said flexible power delivery substrate.  
   
   
       6 . The apparatus of  claim 1  wherein said flexible power delivery substrate comprises a three-layer flex tape.  
   
   
       7 . The apparatus of  claim 6  wherein said three-layer flex tape comprises a first, second and third conductive layer and a first and second dielectric layer, said first dielectric layer between said first and said second conductive layers, said second dielectric layer between said second and said third conductive layers.  
   
   
       8 . The apparatus of  claim 1  further comprising one or more stiffeners coupled to said flexible power delivery substrate.  
   
   
       9 . The apparatus of  claim 8  further comprising a motherboard coupled to said one or more stiffeners.  
   
   
       10 . The apparatus of  claim 1  wherein said flexible power delivery substrate comprises a dielectric material and wherein said dielectric material comprises a dielectric constant greater than 100.  
   
   
       11 . The apparatus of  claim 1  further comprising a flexible I/O (input/output) signal routing substrate coupled to said integrated circuit.  
   
   
       12 . The apparatus of  claim 11  wherein connections between said integrated circuit and said flexible I/O signal routing substrate occur on periphery bumps of said integrated circuit.  
   
   
       13 . The apparatus of  claim 11  wherein said flexible I/O signal routing substrate comprise a plurality of signal traces and wherein two signal traces comprise a differential signal pair.  
   
   
       14 . The apparatus of  claim 11  wherein said flexible I/O signal routing substrate comprises an optical transmission material.  
   
   
       15 . The apparatus of  claim 11  wherein said flexible I/O signal routing substrate comprises an electromagnetic transmission material.  
   
   
       16 . The apparatus of  claim 11  wherein said flexible I/O signal routing substrate comprises a polyimide.  
   
   
       17 . The apparatus of  claim 11  wherein said flexible I/O signal routing substrate comprises a dielectric material, wherein said dielectric material comprises a loss tangent less than 0.01 including a dielectric constant less than 3.  
   
   
       18 . An apparatus comprising: 
 an integrated circuit;    a board coupled to said integrated circuit, said integrated circuit mounted to said board;    a flexible power delivery substrate electrically coupled to said board and said integrated circuit; and    a motherboard coupled to said flexible power delivery substrate.    
   
   
       19 . The apparatus of  claim 18  wherein said flexible power delivery substrate comprises a three-layer flex tape.  
   
   
       20 . The apparatus of  claim 18  further comprising land side capacitors coupled to said flexible power delivery substrate.