Temperature control device and method using peltier element

Abstract

There are provided an device for controlling temperature by Peltier element and a method for controlling temperature by the same, wherein the structure of the device can be simplified, the cost making the device can be reduced and an accuracy of the temperature control of a contact plane based on the detected temperature value with a temperature sensor can be improved by capacitating insulation for a Peltier element and related elements without providing a vacuum case and related elements for encapsulating a Peltier element and related elements. In an device for controlling temperature by Peltier element, wherein a temperature-controlled body is rapidly cooled or heated by Peltier effect generated by contacting the temperature-controlled body with the contact plane connected to a conductive body and by applying a direct current voltage between the Peltier element and the electrode-cum-heat-sink, an device for controlling temperature by Peltier element is characterized in that there are provided an end cover which covers the conductive body, the Peltier element and a whole of the electrode-cum-heat-sink or a part of the conductive body side and which forms a contact plane; a gas layer sealed in a space formed inside the cover; and an insulating layer comprising insulating material in the space formed inside the cover between the conductive body and the gas layer.

1 . A device for controlling temperature of a body to be controlled in temperature (hererafter referred to a temperature-controlled body) by contacting a surface of the device to said body, the device comprising a Peltier element consisting of a pair of semiconductors, an electrically conductive body contacting with an end surface of the Peltier element, an electrode-cum-heat-sink body contacting with the other end surface of the Peltier element, said electrically conductive body being able to be rapidly cooled or heated by virtue of Peltier effect generated by applying DC voltage between the Peltier element and the electrode-cum-heat-sink to cool or heat said temperature-controlled body contacted with said electrically conductive body, 
 wherein an end cover made of electrical insulating material is provided to cover said electrically conductive body and Peltier element such that a closed space is formed around the electrically conductive body and Peltier element, or around the Peltier element, said end cover being formed to have an end plane part to be contacted with said temperature-controlled body when cooling or heating said temperature-controlled body, the inside surface of the end plane part of said end cover or whole or part of the inner peripheral part of said end cover being contacted with said electrically conductive body; and    wherein a gas such as air, chlorofluorocarbon, argon, or others are sealed in said space to form heat insulating stratum.    
     
     
         2 . A device according to  claim 1 , wherein a temperature sensor is provided on the inner surface of the end plane part of said end cover to detect the temperature of the end plane part of the end cover.  
     
     
         3 . A device according to  claim 1 , wherein said end cover is shaped to be tapered towards its end plane part.  
     
     
         4 . A device according to  claim 1 , wherein said electrically conductive body is of an inversed tapered shape enlarged towards its end side contacting with the end plane part  
       of the end cover.  
     
     
         5 . A device according to  claim 1 , wherein said electrically conductive body is formed into a shape bowing along length and reducing in girth or diameter towards its end side contacting with the end plane part of the end cover.  
     
     
         6 . A method of controlling temperature of a body by an device for controlling temperature of a body to be controlled in temperature (hererafter referred to a temperature-controlled body) by contacting a surface of the device to said body, the device comprising a Peltier element consisting of a pair of semiconductors, an electrically conductive body contacting with an end surface of the Peltier element, an electrode-cum-heat-sink body contacting with the other end surface of the Peltier element, said electrically conductive body being able to be rapidly cooled or heated by virtue of Peltier effect generated by applying d.c. voltage between the Peltier element and the electrode-cum-heat-sink to cool or heat said temperature-controlled body contacted with said electrically conductive body, said surface of the device being formed by an end plane part of an end cover made of electrical insulating material, said method comprising: 
 detecting temperature of the end plane part of the end cover being contacted with said temperature-controlled body by a temperature sensor;    controlling temperature of the end plane part of the end cover being contacted with said temperature-controlled body based on the detected temperature by adjusting voltage applied to said Peltier element.    
     
     
         7 . A method of controlling temperature of a body according to  claim 6 , wherein voltage applied to the peltier element and time for applying the voltage are adjusted based on the temperature of the end plane part of the end cover detected by said temperature sensor and a contact area of the end plate part of the end cover with the temperature-controlled body.  
     
     
         8 . A method of controlling temperature of a body according to  claim 6 , wherein said temperature-controlled body is an affected area of a human body, the method comprising:detecting a time when the temperature detected by said temperature sensor reaches a temperature to cancel overcooling, determining timing to start operation for the affected area based on said detected time to cancel overcooling.  
     
     
         9 . A method of controlling temperature of a body according to  claim 6 , wherein a plurality of said electrically conductive bodies each varying in its area of the side contacting to the inside surface of the end plane part of the end cover are prepared, and one of said conductive bodies is adopted in accordance with the area of the temperature-controlled body to be contacted with the surface of the device.