Cleaning member and cleaning method of substrate processing equipment

Abstract

A cleaning member comprising a cleaning layer which is non-adhesive at the temperature range of 25 to 200° C. and has a tensile elastic modulus (Young's modulus) of 3,000 MPa or less, particularly preferably 100 MPa or less, a cleaning sheet having the above cleaning layer as such a cleaning member, or a carrying member with a cleaning function having the above cleaning layer on the carrying member.

1 . A cleaning member comprising a cleaning layer which is non-adhesive at the temperature range of 25 to 200° C. and has a tensile elastic modulus (Young's modulus) of 3,000 MPa or less.  
   
   
       2 . The cleaning member according to  claim 1 , wherein the tensile elastic modulus (Young's modulus) of the cleaning layer is 100 MPa or less.  
   
   
       3 . The cleaning member according to  claim 1  or  2 , which is a cleaning sheet having the cleaning layer.  
   
   
       4 . The cleaning member according to  claim 1  or  2 , which is a carrying member with a cleaning function having the cleaning layer on the carrying member.  
   
   
       5 . The cleaning member according to  claim 4 , wherein the carrying member with a cleaning function comprises the cleaning sheet according to  claim 3  provided on the carrying member through an adhesive layer.  
   
   
       6 . The cleaning member according to  claim 4 , wherein the carrying member with a cleaning function comprises the cleaning layer directly provided on the carrying member.  
   
   
       7 . A cleaning method of a substrate processing equipment, which comprises carrying the cleaning member according to any one of  claims 1  to  6  into the substrate processing equipment.  
   
   
       8 . A substrate processing equipment cleaned by a cleaning method according to  claim 7.