Substrate plating methods and apparatus

Abstract

An apparatus includes a first package substrate, a second package substrate, and a deformable conductor sandwiched between the first package substrate and the second package substrate.

1 . A method for plating a first pad on a first major surface of a substrate, the substrate having a first major surface and a second major surface, the method comprising: 
 connecting the first pad on the first major surface to a second pad on a second major surface of the substrate;    applying a voltage to the second pad; and    placing the first pad on the first major surface into an electrolytic solution.    
     
     
         2 . The method of  claim 1  further comprising masking portions of the first major surface to selectively prevent plating on portions of the first major surface.  
     
     
         3 . The method of  claim 1  wherein connecting the first pad on the first major surface to a second pad on the second major surface includes connecting the first pad and the second pad through a via.  
     
     
         4 . The method of  claim 1  further comprising sealing the second major surface from the electrolytic solution.  
     
     
         5 . The method of  claim 4  wherein sealing the second major surface from the electrolytic solution includes placing a conductive adhesive tape over the second major surface.  
     
     
         6 . The method of  claim 1  wherein applying a voltage to the second pad includes: 
 placing an electrical conductor having a deformable portion in contact with the second pad; and    applying the voltage to the electrical conductor.    
     
     
         7 . A method for plating a first pad on a first major surface on each of a plurality of substrates, each substrate having a first major surface and a second major surface, the method comprising: 
 connecting the first pad on the first major surface to a second pad on a second major surface of the substrate through a via in the substrate;    placing a deformable conductor in contact with the second major surface and the second pad of one of the plurality of substrates;    placing a deformable conductor in contact with the second major surface and the second pad of another of the plurality of substrates; and    applying a voltage to the deformable conductor.    
     
     
         8 . The method of  claim 7  further comprising placing the first pad on the first major surface of the one of the plurality of substrates and another of the plurality of substrates into an electrolytic solution.  
     
     
         9 . The method of  claim 7  wherein placing a deformable conductor in contact with the second major surface and the second pad of one of the plurality of substrates includes placing a first side of a deformable conductor in contact with the second major surface and the second pad of the one of the plurality of substrates  
     
     
         10 . The method of  claim 9  wherein placing a deformable conductor in contact with the second major surface and the second pad of another of the plurality of substrates includes placing a second side of a deformable conductor in contact with the second major surface and the second pad of the one of the plurality of substrates.  
     
     
         11 . The method of  claim 8  further comprising substantially sealing the second major surface of the one of the plurality of substrates from the electrolytic solution.  
     
     
         12 . The method of  claim 8  further comprising: 
 substantially sealing the second major surface of the one of the plurality of substrates from the electrolytic solution; and    substantially sealing the second major surface of another of the plurality of substrates from the electrolytic solution.    
     
     
         13 . The method of  claim 7  wherein the deformable conductor includes a conductive adhesive tape.  
     
     
         14 . The method of  claim 7  wherein the deformable conductor includes: 
 a metal plate;    a first conductive sheet on a first side of the metal plate; and    a second conductive sheet on a second side of the metal plate.    
     
     
         15 . The method of  claim 7  further comprising clamping the one of the plurality of substrates, the other of the plurality of substrates, and the deformable conductor together.  
     
     
         16 . An apparatus comprising: 
 a first package substrate, further including: 
 a first major surface having a first pad;  
 a second major surface having a second pad; and  
 an electrical pathway in the first package substrate between the first pad and the second pad; and  
   a deformable conductor in electrical communication with the second major surface and the second pad.    
     
     
         17 . The apparatus of  claim 16  further comprising a second package substrate, further including: 
 a third major surface having a third pad;    a fourth major surface having a fourth pad; and    an electrical pathway in the second package substrate between the third pad and the fourth pad, wherein the deformable conductor is in electrical communication with the fourth major surface and the fourth pad.    
     
     
         18 . The apparatus of  claim 17  wherein the deformable conductor is a conductive adhesive tape.  
     
     
         19 . The apparatus of  claim 17  wherein the deformable conductor comprises: 
 a metal plate;    a first conductive sheet on a first side of the metal plate; and    a second conductive sheet on a second side of the metal plate.    
     
     
         20 . The apparatus of  claim 19  further comprising a seal coupled to the metal plate, the seal positioned to substantially seal the second pad and the fourth pad from an environment surrounding the first package substrate and the second package substrate.  
     
     
         21 . The apparatus of  claim 19  further comprising a source of current communicatively coupled to the metal plate.  
     
     
         22 . The apparatus of  claim 16  further comprising a source of current communicatively coupled to the deformable conductor.  
     
     
         23 . The apparatus of  claim 16  further comprising an electrolytic bath in fluid communication with the first package substrate.  
     
     
         24 . The apparatus of  claim 17  further comprising an electrolytic bath in fluid communication with the first package substrate and the second package substrate.  
     
     
         25 . An apparatus comprising: 
 a first package substrate further comprising: 
 a first major surface having a first pad;  
 a second major surface having a second pad; and  
 an electrical connection between the first pad and the second pad;  
   a second package substrate further comprising: 
 a third major surface having a third pad;  
 a fourth major surface having a fourth pad; and  
 an electrical connection between the third pad and the fourth pad; and  
   a deformable conductor sandwiched between the first package substrate and the second package substrate.    
     
     
         26 . The apparatus of  claim 25  wherein the deformable conductor deforms to make electrical contact with the second pad and the fourth pad.  
     
     
         27 . The apparatus of  claim 25  wherein the electrical connection between the first pad and the second pad is a via within the first package substrate, and wherein the electrical connection between the third pad and the fourth pad is a via within the second package substrate.  
     
     
         28 . The apparatus of  claim 25  further comprising a seal separating the second pad and the fourth pad from an environment in contact with the first pad and the third pad.  
     
     
         29 . The apparatus of  claim 25  further comprising: 
 an electrolytic fluid in fluid communication with the first pad and the third pad; and    a seal preventing fluid communication of the second pad and the fourth pad with the electrolytic fluid.