Method of installing a radiant density floor heating system

Abstract

A method of installing a radiant density floor heating system, in which a multi-layer conductive/insulation pad is disposed atop the ground or a subfloor, a heating element is placed atop the pad, a concrete or cement layer is laid atop the heating element and pad, and a flooring material is laid atop the cement layer. The pad comprises a first polymer layer having a first side that forms an outer surface of the multi-layer conductive/insulation pad, a conductive layer laminated to an opposite second side of the first polymer layer, a second polymer layer laminated to the side of the conductive layer opposite the first polymer layer, and a first air cellular cushioning layer laminated to the side of the second polymer layer opposite the conductive layer. The pad can also include a second air cellular cushioning layer and/or a protective polymer layer.

1 . A method of installing a radiant density floor heating system, the method comprising the steps of: 
 (a) disposing on a substrate a multi-layer conductive/insulation pad comprising: 
 (i) a first polymer layer having a first side that forms an outer surface of the multi-layer conductive/insulation pad;  
 (ii) a conductive layer laminated to an opposite second side of said first polymer layer;  
 iii) a second polymer layer laminated to the side of said conductive layer opposite said first polymer layer; and  
 (iv) a first air cellular cushioning layer laminated to the side of said second polymer layer opposite said conductive layer;  
   (b) positioning a heating element atop said pad so that when said heating element is activated, heat generated from said heating element is reflected away from said pad; and    (c) providing a layer of cementitious material on said heating element and said pad.    
   
   
       2 . The method of  claim 1 , further comprising the step of: 
 (d) placing a flooring material on said layer of cementitious material.    
   
   
       3 . The method of  claim 1 , wherein said pad further comprises: 
 (v) a protective polymer layer laminated to the side of said first air cellular cushioning layer opposite said second polymer layer;    wherein the pad is disposed with the protective polymer layer against a substrate or subfloor on which the radiant density floor heating system is supported.    
   
   
       4 . The method of  claim 1 , wherein said pad further comprises: 
 a third polymer layer laminated to the side of said first air cellular cushioning layer opposite said second polymer layer, and a second air cellular cushioning layer laminated to the third polymer layer on the side opposite said first air cellular cushioning layer.    
   
   
       5 . The method of  claim 4 , wherein said pad further comprises: 
 a protective polymer layer laminated to the side of said second air cellular cushioning layer opposite said third polymer layer;    wherein the pad is disposed with the protective polymer layer against a substrate or subfloor on which the radiant density floor heating system is supported.    
   
   
       6 . The method of  claim 1 , wherein the layer of cementitious material is provided by pouring wet cementitious material atop the heating element and pad, such that the heating element and pad are at least partially embedded in the layer of cementitious material.  
   
   
       7 . The method of  claim 1 , wherein said conductive layer comprises a thin foil of metal or a metallized thermoplastic layer.  
   
   
       8 . The method of  claim 1 , wherein said conductive layer comprises aluminum.  
   
   
       9 . The method of  claim 1 , wherein said first polymer layer and said second polymer layer each comprises at least one of polyethylene, low density polyethylene, linear low density polyethylene, co-polymers of polyethylene and polypropylene, polyethylene terephthalate, polyamide, and polyvinyl chloride.  
   
   
       10 . The method of  claim 1 , wherein said first polymer layer comprises a pigmented polymer film.  
   
   
       11 . A method of constructing a heated floor, comprising the steps of: 
 disposing a multi-layer conductive/insulation pad atop a substrate, the pad comprising: 
 (a) a first polymer layer having a first side that forms an outer surface of the multi-layer conductive/insulation pad for placement directly against a building structure;  
 (b) a conductive layer laminated to an opposite second side of said first polymer layer;  
 (c) a second polymer layer laminated to the side of said conductive layer opposite said first polymer layer;  
 (d) a first air cellular cushioning layer laminated to the side of said second polymer layer opposite said conductive layer;  
 (e) a second air cellular cushioning layer laminated to the side of said first air cellular cushioning layer opposite said second polymer layer; and  
 (f) a protective polymer layer laminated to the side of said second air cellular cushioning layer opposite said first air cellular cushioning layer;  
 the pad being disposed with the protective layer against the substrate;  
   placing a heating element atop the pad; and    pouring a layer of cementitious material atop the heating element and pad and allowing the layer to harden.