US2005280995A1PendingUtilityA1

Electronic component cooling apparatus

Assignee: SANYO ELECTRIC COPriority: Mar 31, 2003Filed: Aug 25, 2005Published: Dec 22, 2005
Est. expiryMar 31, 2023(expired)· nominal 20-yr term from priority
H10W 40/47F04D 29/588F04D 13/0673F28D 1/05366F04D 13/0633F28D 2021/0031
47
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Claims

Abstract

An electronic component cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for giving a moving energy to the coolant. A plurality of engaging pieces of the motor-driven fan and a plurality of engaged portion of the radiator are engaged to connect the motor-driven fan and the radiator.

Claims

exact text as granted — not AI-modified
1 . A radiator used in an electronic component cooling apparatus, comprising: 
 a plurality of liquid passages arranged side by side;    radiation fins attached to outer surfaces of the liquid passages; and    two liquid tanks arranged each on either side of the plurality of liquid passages and communicably connected to both ends of the plurality of liquid passages;    wherein one of the two liquid tanks is provided with a liquid inlet and the other liquid tank is provided with a liquid outlet;    wherein a chamber in each of the two liquid tanks is divided, in a direction of arrangement of the plurality of liquid passages, into m plus one (m is an integer of one or more) sub-chambers by m partition walls; and    wherein the sub-chambers in each of the two liquid tanks and the plurality of liquid passages are connected with each other in such a manner that one or more of the liquid passages construct a winding liquid path between the liquid inlet and the liquid outlet.    
   
   
       2 . The radiator as defined in  claim 1 , wherein the sub-chamber located uppermost in the other of the two liquid tanks has such shape and size that allow a space to be formed therein that is positioned higher than the sub-chamber located uppermost in the one of the two liquid tanks and that is not filled with the liquid.  
   
   
       3 . A radiator used in an electronic component cooling apparatus, comprising: 
 a plurality of liquid passages arranged side by side;    radiation fins attached to outer surfaces of the liquid passages; and    two liquid tanks arranged one on each side of the plurality of liquid passages and communicably connected to both ends of the plurality of liquid passages;    wherein one of the two liquid tanks is provided with a liquid inlet and a liquid outlet;    wherein a chamber in the one of the two liquid tanks is divided, in a direction of arrangement of the plurality of liquid passages, into n plus one (n is an integer of two or more) sub-chambers by n partition walls;    wherein a chamber in the other of the two liquid tanks is divided, in a direction of arrangement of the plurality of liquid passages, into n sub-chambers by n minus one partition walls; and    wherein the sub-chambers in each of the two liquid tanks and the plurality of liquid passages are connected with each other in such a manner that one or more of the liquid passages construct a winding liquid path between the liquid inlet and the liquid outlet.    
   
   
       4 . The radiator as defined in  claim 3 , wherein the sub-chamber located uppermost in the other of the two liquid tanks has such shape and size that allow a space to be formed therein that is positioned higher than the sub-chamber located uppermost in the one of the two liquid tanks and that is not filled with the liquid.

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