Single component pad backer for polishing head of an orbital chemical mechanical polishing machine and method therefor

Abstract

A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine is formed of a flexible pad. A plurality of holes are formed through the flexible pad. The holes are used to accommodate tile flow of a polishing liquid from the underside of the flexible pad. A plurality of grooves are formed on a backside of the flexible pad for transferring a liquid during the polishing process.

1 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine comprising: 
 a flexible pad;    a plurality of holes formed through the flexible pad to accommodate a flow of a polishing liquid from the underside of the flexible pad; and    a plurality of grooves formed on a backside of the flexible pad for transferring the polishing liquid to the plurality of holes.    
     
     
         2 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 1  wherein the flexible pad is made of a urethane material.  
     
     
         3 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 1  wherein the flexible pad is a circular flexible pad.  
     
     
         4 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 1  wherein the holes are spaced around the pad backer to allow for a fairly uniform flow of polishing liquid from an underside of the pad backer to a top surface of the pad backer.  
     
     
         5 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 1  wherein the holes are formed in a plurality of rows and columns around the pad backer to allow for a fairly uniform flow of polishing liquid from an underside of the pad backer to a top surface of the pad backer.  
     
     
         6 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine comprising: 
 a flexible pad member;    a plurality of holes formed through the flexible pad to accommodate a uniform flow of a polishing liquid from the underside of the flexible pad across a top surface of the flexible pad; and    a plurality of grooves formed on a backside of the flexible pad for transferring the polishing liquid to the plurality of holes.    
     
     
         7 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 6  wherein the flexible pad is made of a urethane material.  
     
     
         8 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 6  wherein the flexible pad is a circular flexible pad.  
     
     
         9 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 6  wherein the holes are formed in a plurality of rows and columns around the pad backer to allow for a fairly uniform flow of polishing liquid from an underside of the pad backer to a top surface of the pad backer.  
     
     
         10 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine comprising: 
 a flexible plate member, wherein the flexible plate member improves upon achieving a uniform surface layer of a semiconductor wafer being polished;    a plurality of holes formed through the flexible plate member to accommodate flow of a polishing liquid from the underside of the flexible plate member to a top surface of the flexible plate member; and    a plurality of grooves formed on a backside of the flexible pad for transferring the polishing liquid to the plurality of holes.    
     
     
         11 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 10  wherein the flexible plate member improves upon achieving a uniform surface layer of a semiconductor wafer being polished by allowing an inflatable air bladder mounted above the pad backer to contact the entire top surface of the pad backer.  
     
     
         12 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 10  wherein the flexible plate member is made of a urethane material.  
     
     
         12 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 10  wherein the flexible plate member is circular in shape.  
     
     
         13 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 10  wherein the holes are spaced around the pad backer to allow for a fairly uniform flow of polishing liquid from an underside of the pad backer to a top surface of the pad backer.  
     
     
         14 . A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine in accordance with  claim 10  wherein the holes are formed in a plurality of rows and columns around the pad backer to allow for a fairly uniform flow of polishing liquid from an underside of the pad backer to a top surface of the pad backer.