System and method for processor power delivery and thermal management

Abstract

A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

1 . A device comprising: 
 a DC-to-DC converter;    a body having at least one side; and    a compression spring retained on one side of said body and clamped between said converter and said body such that the clamping force applied to said body may be resiliently spread through said compression spring.    
   
   
       2 . The device of  claim 1  wherein said spring is corrugated.  
   
   
       3 . A motherboard comprising: 
 a circuit board;    a processor-carrier on said board;    a DC-to-DC converter secured on said carrier;    a housing including a compression spring positioned over said converter; and    a clamp to clamp said housing, converter and carrier together.    
   
   
       4 . The motherboard of  claim 3  wherein said power and ground contacts on each one of said converter and processor carrier are interdigitated.  
   
   
       5 . The motherboard of  claim 3  wherein said carrier contacts engage said board in a direction transverse to the plane of said board.  
   
   
       6 . The motherboard of  claim 3  wherein said converter is clamped onto said carrier.  
   
   
       7 . A interconnect comprising: a non-conductive polymer film; and a plurality of conductive polymer contacts formed in said film.  
   
   
       8 . The interconnect of  claim 7  wherein said film includes opposed surfaces and said contacts extend above a surface of said film.  
   
   
       9 . The interconnect of  claim 8  wherein said contacts extend above both opposed surfaces of said film.  
   
   
       10 . The interconnect of  claim 9  including at least two alignment holes.  
   
   
       11 . The interconnect of  claim 8  wherein said contacts are resilient.  
   
   
       12 . A motherboard comprising: a circuit board; a processor carrier on said board; a DC-to-DC converter secured on said carrier; and a film layer sandwiched between said carrier and said converter, said film layer including conductive polymer contacts in said film layer.  
   
   
       13 . The motherboard of  claim 12  wherein said conductive polymer contacts extend above said film layer.  
   
   
       14 . The motherboard of  claim 12  wherein said conductive polymer contacts electrically couple contacts on said converter and said carrier.  
   
   
       15 . A device comprising: a body having at least one side; and a compression spring retained on one side of said body such that a force applied to said body may be resiliently spread through said compression spring.  
   
   
       16 . The device of  claim 15  wherein said spring is corrugated.  
   
   
       17 . The device of  claim 15  including a DC-to-DC converter, said spring clamped between said converter and said body.  
   
   
       18 . A motherboard comprising: a circuit board; a processor carrier on said board; a DC-to-DC converter secured on said carrier; a housing including a compression spring positioned over said converter; and a clamp to clamp said housing, converter and carrier together.  
   
   
       19 . The motherboard of  claim 18  wherein said power and ground contacts on each one of said converter and processor carrier are interdigitated.  
   
   
       20 . The motherboard of  claim 18  wherein said carrier contacts engage said board in a direction transverse to the plane of said board.  
   
   
       21 . The motherboard of  claim 18  wherein said converter is clamped onto said carrier.