Slurry delivery arm

Abstract

A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled thereto. The restricting device interfaces with the delivery tube and is adapted to provide a variable restriction to flow passing through the delivery tube. In another embodiment, the restricting device is a pinch valve and the tube in continuous from the outlet to beyond a portion that interfaces with the pinch valve. In yet another embodiment, the position of the delivery arm is controllable.

1 . A method for controlling polishing fluid flow in a chemical mechanical polishing apparatus, comprising: 
 positioning an outlet of a tube running through an arm over a polishing surface;    flowing a polishing fluid through the outlet of tube to the polishing surface;    polishing a substrate in contact with the polishing surface in the presence of the polishing fluid;    increasing the sectional area of the tube after polishing; and    flowing fluid through the increased sectional area of the tube.    
   
   
       2 . The method of  claim 1 , wherein the step of flowing polishing fluid further comprises: 
 applying a force to control an interior sectional area of the tube.    
   
   
       3 . The method of  claim 2 , wherein the step of applying force to control the interior sectional area of the tube further comprises: 
 varying the force to change the sectional area of the tube during polishing.    
   
   
       4 . The method of  claim 2 , wherein the step of applying force to control the interior sectional area of the tube further comprises: 
 energizing a pinch valve to a first state corresponding to a first non-zero sectional tube area; and    second state corresponding to a second non-zero sectional tube area.    
   
   
       5 . The method of  claim 2 , wherein the step of applying a force to control the interior sectional area of the tube further comprises: 
 energizing a pinch valve to a first state opening the interior sectional area of the tube to a substantially fully open condition.    
   
   
       6 . The method of  claim 2 , wherein the step of flowing fluid through the increase sectional area of the tube further comprises: 
 rotating the arm to a position clear of the polishing surface.    
   
   
       7 . The method of  claim 2  further comprising: 
 providing a first distribution of polishing fluid on the polishing surface to polish the substrate at a first rate profile; and    providing a second distribution of polishing fluid on the polishing surface to polish the substrate at a second rate profile.    
   
   
       8 . The method of  claim 7 , wherein the step of providing the second distribution of polishing fluid further comprises: 
 changing the quantity of polishing fluid flowing through the first delivery tube.    
   
   
       9 . The method of  claim 7 , wherein the step of providing the second distribution of polishing fluid further comprises: 
 changing the angular orientation of the arm.    
   
   
       10 . A method for controlling polishing fluid flow in a chemical mechanical polishing apparatus, comprising: 
 moving a dispense arm into a first dispense position;    flowing polishing fluid from the arm in the first dispense position to a polishing surface to create a first fluid distribution;    polishing a substrate on the polishing surface having the first fluid distribution;    moving the dispense arm to a second dispense position;    flowing polishing fluid from the arm in the second dispense position to the polishing surface to create a second fluid distribution; and    polishing the substrate on the polishing surface having the second fluid distribution.    
   
   
       11 . A method for controlling polishing fluid flow in a chemical mechanical polishing apparatus, comprising: 
 creating a first volumetric distribution of polishing fluid on a polishing pad surface;    polishing a substrate on the polishing surface having the first volumetric distribution;    moving an outlet flowing polishing fluid to the polishing pad; and    creating a second volumetric distribution of polishing fluid on a polishing pad surface while polishing the substrate.    
   
   
       12 . The method of  claim 11 , wherein the step of moving the outlet further comprises: 
 moving a fluid delivery arm between processing positions.    
   
   
       13 . The method of  claim 11 , wherein the step of moving the outlet further comprises: 
 rotating a fluid delivery arm between processing positions.    
   
   
       14 . The method of  claim 11  further comprising: 
 polishing the substrate in the presence of the first volumetric distribution of polishing fluid at a first rate profile; and    polishing the substrate in the presence of the second volumetric distribution of polishing fluid at a second rate profile.