Method and apparatus for cleaning mounting nozzle, and mounting machine

Abstract

A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, and a grain size of a contact surface of the abrading unit ranges from P1000 to P5000, the contact surface of the abrading unit coming into contact with the suction surface of the mounting nozzle.

1 . A cleaning apparatus which is used for an electronic component mounting machine, the electronic component mounting machine including a mounting nozzle for mounting an electronic component on a circuit board, a suction surface which sucks and holds the electronic component being provided at a leading end portion of the mounting nozzle, 
 the apparatus comprising:    abrading means for rubbing the suction surface of the mounting nozzle; and    drive means for moving the abrading means in a predetermined direction,    wherein the abrading means is formed by a ceramics structure, and a grain size of a contact surface of the abrading means ranges from P1000 to P5000 (JIS R6010: 2000), the contact surface of the abrading means coming into contact with the suction surface of the mounting nozzle.    
   
   
       2 . A cleaning apparatus according to  claim 1 , wherein the ceramics structure is made of any one of alumina ceramics, zirconia ceramics, silicon nitride ceramics, and silicon carbide ceramics.  
   
   
       3 . An electronic component mounting machine comprising a cleaning apparatus according to  claim 1 .  
   
   
       4 . An electronic component mounting machine comprising a cleaning apparatus according to  claim 2 .  
   
   
       5 . A method for cleaning a mounting nozzle, which is used in order to suck and hold an electronic chip component when the electronic chip component is mounted on a circuit board and the like, the cleaning method comprising the steps of: 
 pressing a suction surface of the mounting nozzle against an abrasive member including a ceramics structure whose grain size ranges from P1000 to P5000 (JIS R6010: 2000); and    moving relatively the abrasive member in parallel with the suction surface to abrade the suction surface in a state where the suction surface is pressed against the abrasive member.